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| 型号： | TDA8946AJ |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 15 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP17 |
| 封装： | PLASTIC, DIL-BENT-SIL, 17 PIN |
| 文件页数： | 10/20页 |
| 文件大小： | 376K |
| 代理商： | TDA8946AJ |
Philips Semiconductors
TDA8946AJ
2 x 15 W BTL audio amplier with DC gain control
Product data
Rev. 01 — 01 March 2002
18 of 20
9397 750 09434
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
17. Soldering
17.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specied maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°C, contact may be up to 5 seconds.
17.4 Package related soldering information
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
18. Revision history
Table 10:
Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Package
Soldering method
Dipping
Wave
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable[1]
Table 11:
Revision history
Rev Date
CPCN
Description
01
20020301
-
Product data (9397 750 09434)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA8946AJ/N2,112 | 功能描述:音频放大器 2X15W AUDIO AMP VOL CTRL RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA8946J | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2 x 15 W stereo Bridge Tied Load BTL audio amplifier |
| TDA8946J/N1,112 | 功能描述:音频放大器 AUDIO AMP 2X15W RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA8947J | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-channel audio amplifier (SE: 1 W to 25 W; BTL: 4 W to 50 W) |
| TDA8947J/N3,112 | 功能描述:音频放大器 3/4 CHANNEL AUD AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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