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| 型号： | TDA8946AJ |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 15 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP17 |
| 封装： | PLASTIC, DIL-BENT-SIL, 17 PIN |
| 文件页数： | 7/20页 |
| 文件大小： | 376K |
| 代理商： | TDA8946AJ |
Philips Semiconductors
TDA8946AJ
2 x 15 W BTL audio amplier with DC gain control
Product data
Rev. 01 — 01 March 2002
15 of 20
9397 750 09434
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
14.1.2
Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR - typical 100 nF - has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor - e.g. 1000
F or greater - must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
14.2 Thermal behaviour and heatsink calculation
The measured maximum thermal resistance of the IC package, Rth(j-mb) is 2.5 K/W.
A calculation for the heatsink can be made, with the following parameters:
Tamb =50 °C
VCC = 18 V and RL =8
Tj(max) = 150 °C
Rth(tot) is the total thermal resistance between the junction and the ambient
including the heatsink. In the heatsink calculations the value of Rth(mb-h) is ignored.
Fig 16. Printed-circuit board layout (single-sided); components view.
MGW628
100 nF
220
nF
220 nF
4.7
nF
1
4.7
nF
1000
F
10
F
4
4
4
4
OUT1
IN2
IN2
+
IN1
IN1
+
OUT1
+
OUT2
OUT2
+
GC
SGND
GND
VCC
ON
MODE
SVR
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA8946AJ/N2,112 | 功能描述:音频放大器 2X15W AUDIO AMP VOL CTRL RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA8946J | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2 x 15 W stereo Bridge Tied Load BTL audio amplifier |
| TDA8946J/N1,112 | 功能描述:音频放大器 AUDIO AMP 2X15W RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA8947J | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-channel audio amplifier (SE: 1 W to 25 W; BTL: 4 W to 50 W) |
| TDA8947J/N3,112 | 功能描述:音频放大器 3/4 CHANNEL AUD AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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