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| 型号： | TDA9884HN |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 接收器 |
| 英文描述： | AM/FM, AUDIO/VIDEO DEMODULATOR, PQCC32 |
| 封装： | 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, HVQFN-32 |
| 文件页数： | 48/58页 |
| 文件大小： | 290K |
| 代理商： | TDA9884HN |
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TDA9884_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 12 May 2006
52 of 58
Philips Semiconductors
TDA9884
I2C-bus controlled multistandard alignment-free IF-PLL
15. Soldering
15.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne pitch
SMDs. In these situations reow soldering is recommended.
15.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215
°Cto260 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 240
°C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
相关PDF资料 |
PDF描述 |
|---|---|
| TDA9885HN/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PQCC32 |
| TDA9885T/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24 |
| TDA9885TS/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24 |
| TDA9886HN/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PQCC32 |
| TDA9886T/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA9884TS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I2C-bus controlled multistandard alignment-free IF-PLL for mobile reception |
| TDA9884TS/V1 | 功能描述:调节器/解调器 MOBILE VIF AND SIF DEMODULATOR RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel |
| TDA9884TS/V1,112 | 功能描述:调节器/解调器 MOBILE VIF AND SIF RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel |
| TDA9884TS/V1,118 | 功能描述:调节器/解调器 MOBILE VIF AND SIF RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel |
| TDA9884TS/V1/S1,11 | 功能描述:调节器/解调器 MOBILE VIF AND SIF RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel |
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