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参数资料
| 型号： | TDA9884HN |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 接收器 |
| 英文描述： | AM/FM, AUDIO/VIDEO DEMODULATOR, PQCC32 |
| 封装： | 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, HVQFN-32 |
| 文件页数： | 50/58页 |
| 文件大小： | 290K |
| 代理商： | TDA9884HN |
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TDA9884_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 12 May 2006
54 of 58
Philips Semiconductors
TDA9884
I2C-bus controlled multistandard alignment-free IF-PLL
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
相关PDF资料 |
PDF描述 |
|---|---|
| TDA9885HN/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PQCC32 |
| TDA9885T/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24 |
| TDA9885TS/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24 |
| TDA9886HN/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PQCC32 |
| TDA9886T/V5 | AM/FM, AUDIO/VIDEO DEMODULATOR, PDSO24 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA9884TS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I2C-bus controlled multistandard alignment-free IF-PLL for mobile reception |
| TDA9884TS/V1 | 功能描述:调节器/解调器 MOBILE VIF AND SIF DEMODULATOR RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel |
| TDA9884TS/V1,112 | 功能描述:调节器/解调器 MOBILE VIF AND SIF RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel |
| TDA9884TS/V1,118 | 功能描述:调节器/解调器 MOBILE VIF AND SIF RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel |
| TDA9884TS/V1/S1,11 | 功能描述:调节器/解调器 MOBILE VIF AND SIF RoHS:否 制造商:Texas Instruments 封装 / 箱体:PVQFN-N24 封装:Reel |
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