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| 型号： | TDA9897HN/V2 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 消费家电 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQCC48 |
| 封装： | 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, SOT619-1, MO-220, HVQFN-48 |
| 文件页数： | 103/103页 |
| 文件大小： | 511K |
| 代理商： | TDA9897HN/V2 |
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TDA9897_TDA9898_3
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 — 11 January 2008
99 of 103
NXP Semiconductors
TDA9897; TDA9898
Multistandard hybrid IF processing
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°C
or 265
°C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ux will eliminate the need for removal of corrosive residues in most
applications.
16.3.3 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the at part of the lead. Contact time must be
limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°C and 320 °C.
16.4 Package related soldering information
Table 60.
Suitability of IC packages for wave, reow and dipping soldering methods
Mounting
Package[1]
Soldering method
Wave
Reow[2]
Dipping
Through-hole mount
CPGA, HCPGA
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable[3]
suitable
Through-hole-surface
mount
PMFP[4]
not suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA9897S1 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9897V2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9898 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9898HL | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9898HL/V2/S1,11 | 功能描述:上下转换器 MULTI APPL SYS RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
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