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| 型号： | TDA9897HN/V2 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 消费家电 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQCC48 |
| 封装： | 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, SOT619-1, MO-220, HVQFN-48 |
| 文件页数： | 3/103页 |
| 文件大小： | 511K |
| 代理商： | TDA9897HN/V2 |
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TDA9897_TDA9898_3
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 — 11 January 2008
100 of 103
NXP Semiconductors
TDA9897; TDA9898
Multistandard hybrid IF processing
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note (AN01026); order a copy from your NXP
Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with
respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of
the moisture in them (the so called popcorn effect).
[3]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
[4]
Hot bar soldering or manual soldering is suitable for PMFP packages.
[5]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must on no account be processed
through more than one soldering cycle or subjected to infrared reow soldering with peak temperature exceeding 217
°C ± 10 °C
measured in the atmosphere of the reow oven. The package body peak temperature must be kept as low as possible.
[6]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate
between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the
heatsink surface.
[7]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction. The package footprint
must incorporate solder thieves downstream and at the side corners.
[8]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is denitely not suitable for
packages with a pitch (e) equal to or smaller than 0.65 mm.
[9]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is denitely
not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on ex foil.
However, the image sensor package can be mounted by the client on a ex foil by using a hot bar soldering process. The appropriate
soldering prole can be provided on request.
17. Abbreviations
Surface mount
BGA, HTSSON..T[5], LBGA,
LFBGA, SQFP, SSOP..T[5], TFBGA,
VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP,
HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[6]
suitable
PLCC[7], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[7][8]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended[9]
suitable
CWQCCN..L[10], WQCCN..L[10]
not suitable
Table 60.
Suitability of IC packages for wave, reow and dipping soldering methods …continued
Mounting
Package[1]
Soldering method
Wave
Reow[2]
Dipping
Table 61.
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
AFC
Automatic Frequency Control
AGC
Automatic Gain Control
ATV
Analog TV
BP
Band-Pass
CW
Continuous Wave
DAC
Digital-to-Analog Converter
DC
Direct Current
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA9897S1 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9897V2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9898 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9898HL | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Multistandard hybrid IF processing |
| TDA9898HL/V2/S1,11 | 功能描述:上下转换器 MULTI APPL SYS RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
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