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参数资料
| 型号： | TEA1401T-T |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 稳压器 |
| 英文描述： | 1 A SWITCHING REGULATOR, 150 kHz SWITCHING FREQ-MAX, PDSO20 |
| 封装： | 7.50 MM, PLASTIC, MS-013AC, SOT-163-1, SOP-20 |
| 文件页数： | 9/20页 |
| 文件大小： | 119K |
| 代理商： | TEA1401T-T |
1997 Mar 07
17
Philips Semiconductors
Preliminary specication
Power plug for the universal mains
TEA1401T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
Reow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°C within
6 seconds. Typical dwell time is 4 seconds at 250
°C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°C.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TEA1402/N2,112 | 功能描述:电池管理 TEA1402/DIP18/TUBE-B RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| TEA1501 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Greeny; GreenChip |
| TEA1501T/N1,118 | 功能描述:交流/直流开关转换器 GREENCHIP SMPS CONTROL IC RoHS:否 制造商:STMicroelectronics 输出电压:800 V 输入/电源电压（最大值）:23.5 V 输入/电源电压（最小值）:11.5 V 开关频率:115 kHz 电源电流:1.6 mA 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SSO-10 封装:Reel |
| TEA1504 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:GreenChip SMPS control IC |
| TEA1506 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:GreenChip SMPS control IC |
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