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| 型号： | TEA5766UK/N1/S21,1 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 接收器 |
| 英文描述： | FM, AUDIO SINGLE CHIP RECEIVER, PBGA25 |
| 封装： | 3.30 X 3.25 MM, 0.60 MM HEIGHT, WLCSP-25 |
| 文件页数： | 50/59页 |
| 文件大小： | 273K |
| 代理商： | TEA5766UK/N1/S21,1 |
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TEA5766UK_1
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 22 March 2007
54 of 59
NXP Semiconductors
TEA5766UK
Stereo FM radio + RDS
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 23.
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
16.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefcient) differences between substrate and chip.
16.3.2 Quality of solder joint
A ip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reow can occur during the reow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
MSL: Moisture Sensitivity Level
Fig 23. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TEA5767 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:single-chip FM stereo radio |
| TEA5767HL | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-power FM stereo radio for handheld applications |
| TEA5767HN | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-power FM stereo radio for handheld applications |
| TEA5767HN/V3 | 功能描述:射频收发器 FM RECEIVER RoHS:否 制造商:Atmel 频率范围:2322 MHz to 2527 MHz 最大数据速率:2000 Kbps 调制格式:OQPSK 输出功率:4 dBm 类型: 工作电源电压:1.8 V to 3.6 V 最大工作温度:+ 85 C 接口类型:SPI 封装 / 箱体:QFN-32 封装:Tray |
| TEA5767HN/V3,118 | 功能描述:射频收发器 FM RECEIVER RoHS:否 制造商:Atmel 频率范围:2322 MHz to 2527 MHz 最大数据速率:2000 Kbps 调制格式:OQPSK 输出功率:4 dBm 类型: 工作电源电压:1.8 V to 3.6 V 最大工作温度:+ 85 C 接口类型:SPI 封装 / 箱体:QFN-32 封装:Tray |
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