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| 型号： | TH71111ENE-BAA-000-TR |
| 厂商： | Melexis Technologies NV |
| 文件页数： | 19/20页 |
| 文件大小： | 0K |
| 描述： | IC RECEIVER SGL CONV 32-LQFP |
| 应用说明： | Receiver Design Appl Note |
| 标准包装： | 250 |
| 频率： | 789.3MHz ~ 940.7MHz |
| 灵敏度： | -112dBm |
| 数据传输率 - 最大： | 260 kbps |
| 调制或协议： | ASK，FM，FSK |
| 应用： | 报警和安全系统，RKE，TPMS |
| 电流 - 接收： | 9.2mA |
| 数据接口： | PCB，表面贴装 |
| 天线连接器： | PCB，表面贴装 |
| 电源电压： | 2.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 32-LQFP |
| 供应商设备封装： | 32-LQFP（7x7） |
| 包装： | 托盘 |
| 产品目录页面： | 571 (CN2011-ZH PDF) |
| 其它名称： | TH71111 TH71111.2 TH71111ENE TH71111ENE-ND |
TH71111
868/915MHz
FSK/ASK Receiver
6
Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitiv-
ity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
?
?
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
?
?
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
?
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
?
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak tempera-
ture, temperature gradient, temperature profile etc) additional classification and qualification tests have to be
agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more in-
formation on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
7 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
39010 71111
Rev. 015
Page 19 of 20
Data Sheet
Jun/12
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TH71112 | 制造商:MELEXIS 制造商全称:Melexis Microelectronic Systems 功能描述:868/915MHz FSK/FM/ASK Receiver |
| TH71112ENE | 制造商:MELEXIS 制造商全称:Melexis Microelectronic Systems 功能描述:868/915MHz FSK/FM/ASK Receiver |
| TH71112ENE-BAA-000-RE | 制造商:Melexis Semiconductors 功能描述:IC RECEIVER FSK/ASK 32LQFP 制造商:Melexis Semiconductors 功能描述:TH71112 Series 260 kbps 9.2 mA SMT 868/915 MHz FSK/ASK Receiver - LQFP-32 |
| TH71112ENE-BAA-000-TR | 功能描述:IC RECEIVER DBL-CON 32-LQFP RoHS:是 类别:RF/IF 和 RFID >> RF 接收器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 09/Jan/2012 标准包装:50 系列:* 频率:850MHz ~ 2.175GHz 灵敏度:- 数据传输率 - 最大:- 调制或协议:- 应用:* 电流 - 接收:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 特点:- 电源电压:4.75 V ~ 5.25 V 工作温度:0°C ~ 85°C 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（6x6） 包装:托盘 |
| TH711311 | 制造商:C&K Components 功能描述: |
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