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参数资料
| 型号： | THS3001HVIDGNRG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, MSOP-8 |
| 文件页数： | 17/38页 |
| 文件大小： | 875K |
| 代理商： | THS3001HVIDGNRG4 |
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P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of THS3001 (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA
= Free-ambient air temperature (
°C)
θJA = Thermal coefficient from die junction to ambient air (°C/W)
TA Free-Air Temperature °C
1
0
20
1.5
0.5
0
40
100
40
60
80
P
D
Maximum
Power
Dissipation
W
SOIC-D Package:
θJA = 169°C/W
TJ = 150°C
No Airflow
SLOS217H – JULY 1998 – REVISED SEPTEMBER 2009................................................................................................................................................. www.ti.com
THERMAL INFORMATION
The THS3001 incorporates output-current-limiting protection. Should the output become shorted to ground, the
output current is automatically limited to the value given in the data sheet. While this protects the output against
excessive current, the device internal power dissipation increases due to the high current and large voltage drop
across the output transistors. Continuous output shorts are not recommended and could damage the device.
Additionally, connection of the amplifier output to one of the supply rails (±VCC) is not recommended. Failure of
the device is possible under this condition and should be avoided. But, the THS3001 does not incorporate
thermal-shutdown protection. Because of this, special attention must be paid to the device's power dissipation or
failure may result.
The thermal coefficient
θJA is approximately 169°C/W for the SOIC 8-pin D package. For a given θJA, the
maximum power dissipation, shown in Figure 55, is calculated by the following formula:
Figure 55. Maximum Power Dissipation vs Free-Air Temperature
24
Copyright 1998–2009, Texas Instruments Incorporated
Product Folder Link(s): THS3001
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相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3001ID | 功能描述:高速运算放大器 420MHz Current RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3001ID | 制造商:Texas Instruments 功能描述:IC SM OP-AMP HIGH SPEED CFB |
| THS3001ID | 制造商:Texas Instruments 功能描述:OP AMP HIGH SPEED CFB SMD 3001 |
| THS3001IDG4 | 功能描述:高速运算放大器 420-MHz Curr Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3001IDGN | 功能描述:高速运算放大器 420-MHz Curr Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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