- 您现在的位置：买卖IC网 > PDF目录98221 > THS3092DDAG4 (TEXAS INSTRUMENTS INC) 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 PDF资料下载
参数资料
| 型号： | THS3092DDAG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, SOP-8 |
| 文件页数： | 16/37页 |
| 文件大小： | 1775K |
| 代理商： | THS3092DDAG4 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页当前第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页
www.ti.com
PowerPAD LAYOUT CONSIDERATIONS
POWER DISSIPATION AND THERMAL
P
Dmax
+
Tmax * TA
q
JA
where:
PDmax is the maximum power dissipation in the amplifier (W).
Tmax is the absolute maximum junction temperature (°C).
TA is the ambient temperature (°C).
θJA = θJC + θCA
θJC is the thermal coefficient from the silicon junctions to the
case (
°C/W).
θCA is the thermal coefficient from the case to ambient air
(
°C/W).
SLOS428B – DECEMBER 2003 – REVISED FEBRUARY 2006
CONSIDERATIONS
1. PCB with a top side etch pattern as shown in
Figure 67. There should be etch for the leads as
The
THS3092/6
incorporates
automatic
thermal
well as etch for the thermal pad.
shutoff protection. This protection circuitry shuts down
the amplifier if the junction temperature exceeds
2. Place 13 holes in the area of the thermal pad.
approximately 160°C. When the junction temperature
These holes should be 10 mils in diameter. Keep
reduces to approximately 140°C, the amplifier turns
them small so that solder wicking through the
on
again.
But,
for
maximum
performance
and
holes is not a problem during reflow.
reliability, the designer must take care to ensure that
3. Additional vias may be placed anywhere along
the design does not exeed a junction temperature of
the thermal plane outside of the thermal pad
125°C. Between 125°C and 150°C, damage does not
area. This helps dissipate the heat generated by
occur, but the performance of the amplifier begins to
the THS3092/6 IC. These additional vias may be
degrade and long term reliability suffers. The thermal
larger than the 10-mil diameter vias directly under
characteristics of the device are dictated by the
the thermal pad. They can be larger because
package
and
the
PC
board.
Maximum
power
they are not in the thermal pad area to be
dissipation for a given package can be calculated
soldered so that wicking is not a problem.
using the following formula.
4. Connect all holes to the internal ground plane.
Note that the PowerPAD is electrically isolated
from the silicon and all leads. Connecting the
PowerPAD to any potential voltage such as VS-,
is acceptable as there is no electrical connection
to the silicon.
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
connection methodology. Web connections have
a high thermal resistance connection that is
useful for slowing the heat transfer during
soldering operations. This makes the soldering of
vias that have plane connections easier. In this
application, however, low thermal resistance is
desired for the most efficient heat transfer.
For systems where heat dissipation is more critical,
Therefore,
the
holes
under
the
THS3092/6
the THS3092 is offered in an 8-pin SOIC (DDA) with
PowerPAD
package
should
make
their
PowerPAD package, and the THS3096 is offered in a
connection to the internal ground plane with a
14-pin TSSOP (PWP) with PowerPAD package for
complete
connection
around
the
entire
even
better
thermal
performance.
The
thermal
circumference of the plated-through hole.
coefficient
for
the
PowerPAD
packages
are
6. The top-side solder mask should leave the
substantially improved over the traditional SOIC.
terminals of the package and the thermal pad
Maximum power dissipation levels are depicted in the
area with its 13 holes exposed. The bottom-side
graph for the available packages. The data for the
solder mask should cover the 13 holes of the
PowerPAD packages assume a board layout that
thermal pad area. This prevents solder from
follows the PowerPAD layout guidelines referenced
being pulled away from the thermal pad area
above and detailed in the PowerPAD application note
during the reflow process.
(literature number SLMA002). The following graph
7. Apply solder paste to the exposed thermal pad
also illustrates the effect of not soldering the
area and all of the IC terminals.
PowerPAD to a PCB. The thermal impedance
increases substantially which may cause serious heat
8. With these preparatory steps in place, the IC is
and performance issues. Be sure to always solder the
simply placed in position and run through the
PowerPAD to the PCB for optimum performance.
solder
reflow
operation
as
any
standard
surface-mount component. This results in a part
that is properly installed.
23
相关PDF资料 |
PDF描述 |
|---|---|
| THS3095DRG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3096DR | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14 |
| THS3096D | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14 |
| THS3096PWPR | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14 |
| THS3096PWP | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3092DDAR | 功能描述:高速运算放大器 Dual Hig-Vltg Low Distortion RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3092DDARG3 | 功能描述:高速运算放大器 Dual Hig-Vltg Low Distortion RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3092DG4 | 功能描述:高速运算放大器 Dual Hig-Vltg Low Distortion RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3092DR | 功能描述:高速运算放大器 Dual Hig-Vltg Low Distortion RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3092DRG4 | 功能描述:高速运算放大器 Dual Hig-Vltg Low Distortion RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
发布紧急采购，3分钟左右您将得到回复。