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参数资料
| 型号： | THS3201MDGNEP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | PLASTIC, MSOP-8 |
| 文件页数： | 15/29页 |
| 文件大小： | 709K |
| 代理商： | THS3201MDGNEP |
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PowerPAD Design Considerations
0.060
0.040
0.075
0.025
0.205
0.010
vias
Pin 1
Top View
0.017
0.035
0.094
0.030
0.013
PowerPAD PCB Layout Considerations
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
SGLS283B – APRIL 2005 – REVISED JANUARY 2009 ..................................................................................................................................................... www.ti.com
impossible to achieve a smooth, stable frequency
response. Best results are obtained by soldering
THS3201 parts directly onto the board.
The THS3201 is available in a thermally-enhanced
PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which
the
die
is
mounted
[see
63(a)
and
Figure 63(b)]. This arrangement results in the lead
frame being exposed as a thermal pad on the
underside of the package [see Figure 63(c)]. Because
this thermal pad has direct thermal contact with the
die, excellent thermal performance can be achieved
by providing a good thermal path away from the
thermal pad.
Figure 64. DGN PowerPAD PCB Etch and Via
The PowerPAD package allows for both assembly
Pattern
and thermal management in one manufacturing
operation. During the surface-mount solder operation
(when the leads are being soldered), the thermal pad
can also be soldered to a copper area underneath the
package. Through the use of thermal paths within this
1. Prepare the PCB with a top-side etch pattern as
copper area, heat can be conducted away from the
shown in Figure 64. There should be etch for the
package
into
either
a
ground
plane
or
other
leads as well as etch for the thermal pad.
heat-dissipating device.
2. Place five holes in the area of the thermal pad.
The PowerPAD package represents a breakthrough
These holes should be 10 mils in diameter. Keep
in combining the small area and ease of assembly of
them small so that solder wicking through the
surface
mount
with
the,
heretofore,
awkward
holes is not a problem during reflow.
mechanical methods of heatsinking.
3. Additional vias may be placed anywhere along
the thermal plane outside of the thermal-pad
area. This helps dissipate the heat generated by
the THS3201 IC. These additional vias may be
larger than the 10-mil diameter vias directly under
the thermal-pad. They can be larger because
they are not in the thermal pad area to be
soldered so that wicking is not a problem.
4. Connect all holes to the internal ground plane.
Figure 63. Views of Thermally Enhanced Package
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
Although there are many ways to properly heat sink
connection methodology. Web connections have
the PowerPAD package, the following steps define
a high thermal resistance connection that is
the recommended approach.
useful for slowing the heat transfer during
soldering operations. This makes the soldering of
vias that have plane connections easier. In this
application, however, low thermal resistance is
desired for the most efficient heat transfer.
Therefore,
the
holes
under
the
THS3201
PowerPAD
package
should
make
their
connection to the internal ground plane with a
complete
connection
around
the
entire
circumference of the plated-through hole.
6. The top-side solder mask should leave the
terminals of the package and the thermal-pad
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal-pad area. This prevents solder from
22
Copyright 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): THS3201-EP
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相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3201MDGNEP(1) | 制造商:TI 制造商全称:Texas Instruments 功能描述:1.8-GHz LOW-DISTORTION CURRENT-FEEDBACK AMPLIFIER |
| THS3201MDGNREP | 功能描述:高速运算放大器 Mil Enhance 1.8GHz Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3201MDREP(1) | 制造商:TI 制造商全称:Texas Instruments 功能描述:1.8-GHz LOW-DISTORTION CURRENT-FEEDBACK AMPLIFIER |
| THS3202 | 制造商:TI 制造商全称:Texas Instruments 功能描述:LOW-DISTORTION HIGH-SPEED VOLTAGE FEEDBACK AMPLIFIER |
| THS3202D | 功能描述:高速运算放大器 2GHz Current Feedback Amplifier RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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