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参数资料
| 型号： | THS3201MDGNEP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | PLASTIC, MSOP-8 |
| 文件页数： | 16/29页 |
| 文件大小： | 709K |
| 代理商： | THS3201MDGNEP |
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Power Dissipation and Thermal
θJA = 58.4°C/W for 8-Pin MSOP w/PowerPad (DGN)
θJA = 98°C/W for 8-Pin SOIC High Test PCB (D)
θJA = 158°C/W for 8-Pin MSOP w/PowerPad w/o Solder
Results are With No Air Flow and PCB Size = 3”x3”
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-40
-20
0
20
40
60
80
100
P
D
-
Maximum
Power
Dissipation
-
W
TA - Free-Air Temperature - °C
θJA = 98°C/W
θJA = 158°C/W
TJ = 125°C
θJA = 58.4°C/W
Design Tools
Evaluation Fixture, Spice Models, and
P
Dmax +
Tmax * TA
q
JA
where:
PDmax is the maximum power dissipation in the
amplifier (W).
Tmax is the absolute maximum junction
temperature (
°C).
TA is the ambient temperature (°C).
θJA = θJC + θCA
θJC is the thermal coefficient from the silicon
junctions to the case (
°C/W).
θCA is the thermal coefficient from the case to
ambient air (
°C/W).
www.ti.com ..................................................................................................................................................... SGLS283B – APRIL 2005 – REVISED JANUARY 2009
being pulled away from the thermal-pad area
the effect of not soldering the PowerPAD to a PCB.
during the reflow process.
The
thermal
impedance
increases
substantially,
which may cause serious heat and performance
7. Apply solder paste to the exposed thermal-pad
issues. Be sure to always solder the PowerPAD to
area and all of the IC terminals.
the PCB for optimum performance.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
solder
reflow
operation
as
any
standard
surface-mount component. This results in a part
that is properly installed.
Considerations
To
maintain
maximum
output
capabilities,
the
THS3201 does not incorporate automatic thermal
shutoff protection. The designer must take care to
ensure that the design does not violate the absolute
maximum junction temperature of the device. Failure
may
result
if
the
absolute
maximum
junction
temperature of 150°C is exceeded. For the best
performance,
design
for
a
maximum
junction
temperature of 125°C. Between 125°C and 150°C,
damage does not occur, but the performance of the
amplifier begins to degrade.
Figure 65. Maximum Power Dissipation vs
The thermal characteristics of the device are dictated
Ambient Temperature
by the package and the PC board. Maximum power
dissipation for a given package can be calculated
When determining whether or not the device satisfies
using the following formula.
the maximum power-dissipation requirement, it is
important to not only consider quiescent power
dissipation, but also dynamic power dissipation. Often
times, this is difficult to quantify because the signal
pattern is inconsistent, but an estimate of the RMS
power dissipation can provide visibility into a possible
problem.
Applications Support
TI is committed to providing its customers with the
highest quality of applications support. To support this
For systems where heat dissipation is more critical,
goal, an evaluation board has been developed for the
the THS3201 is offered in an 8-pin MSOP with
THS3201 operational amplifier. The board is easy to
PowerPAD and the THS3201 is available in the
use, allowing for straightforward evaluation of the
SOIC-8 PowerPAD package offering even better
device. The evaluation board can be ordered through
thermal performance. The thermal coefficient for the
the TI web site, www.ti.com, or through your local TI
PowerPAD packages are substantially improved over
sales representative. The schematic diagram, board
the traditional SOIC. Maximum power dissipation
layers, and bill of materials of the evaluation boards
levels are listed in the Dissipation Ratings table.. The
data for the PowerPAD packages assume a board
layout that follows the PowerPAD layout guidelines
referenced above and detailed in the PowerPAD
application report SLMA002. Figure 65 also shows
Copyright 2005–2009, Texas Instruments Incorporated
23
Product Folder Link(s): THS3201-EP
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相关代理商/技术参数 |
参数描述 |
|---|---|
| THS3201MDGNEP(1) | 制造商:TI 制造商全称:Texas Instruments 功能描述:1.8-GHz LOW-DISTORTION CURRENT-FEEDBACK AMPLIFIER |
| THS3201MDGNREP | 功能描述:高速运算放大器 Mil Enhance 1.8GHz Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS3201MDREP(1) | 制造商:TI 制造商全称:Texas Instruments 功能描述:1.8-GHz LOW-DISTORTION CURRENT-FEEDBACK AMPLIFIER |
| THS3202 | 制造商:TI 制造商全称:Texas Instruments 功能描述:LOW-DISTORTION HIGH-SPEED VOLTAGE FEEDBACK AMPLIFIER |
| THS3202D | 功能描述:高速运算放大器 2GHz Current Feedback Amplifier RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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