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| 型号： | THS4022IDRG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 2 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | PLASTIC, MS-012AA, SOIC-8 |
| 文件页数： | 8/28页 |
| 文件大小： | 922K |
| 代理商： | THS4022IDRG4 |
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P
D +
T
MAX
–T
A
q
JA
TA Free-Air Temperature °C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
40
20
0
20
40
60
80
100
Maximum
Power
Dissipation
W
G029
DGN Package
θJA = 58.4°C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θJA = 158°C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θJA = 98°C/W
SOIC Package
Low-K Test PCB
θJA = 167°C/W
TJ = 150°C
SLOS265C – SEPTEMBER 1999 – REVISED JULY 2007
7. Apply solder paste to the exposed thermal pad area and all of the IC terminals.
8. With these preparatory steps in place, the THS402xDGN IC is simply placed in position and run through the
solder reflow operation as any standard surface-mount component. This results in a part that is properly
installed.
The actual thermal performance achieved with the THS402xDGN in its PowerPAD package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
× 3 inches
(7.62 cm
× 7.62 cm), then the expected thermal coefficient, θ
JA, is about 58.4°C/W. For comparison, the
non-PowerPAD version of the THS402x IC (SOIC) is shown. For a given
θJA, the maximum power dissipation is
shown in Figure 39 and is calculated by the following formula:
where:
PD = Maximum power dissipation of THS402x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA = Free-ambient air temperature (°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
NOTE: Results are with no air flow and PCB size = 3 in.
× 3 in. (7.62 cm × 7.62 cm).
Figure 39. Maximum Power Dissipation vs Free-Air Temperature
More-complete details of the thermal pad installation process and thermal management techniques can be found
in the PowerPAD Thermally Enhanced Package application report (SLMA002).
16
Copyright 1999–2007, Texas Instruments Incorporated
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相关代理商/技术参数 |
参数描述 |
|---|---|
| THS4031 | 制造商:TI 制造商全称:Texas Instruments 功能描述:100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4031CD | 功能描述:高速运算放大器 100MHz Low Noise RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4031CD | 制造商:Texas Instruments 功能描述:IC SM OP-AMP 100MHZ |
| THS4031CDG4 | 功能描述:高速运算放大器 100-MHz Low Noise Volt-Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4031CDGN | 功能描述:高速运算放大器 100-MHz Low Noise Volt-Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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