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参数资料
| 型号： | THS4081IDGNR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封装： | GREEN, PLASTIC, MSOP-8 |
| 文件页数： | 10/32页 |
| 文件大小： | 841K |
| 代理商： | THS4081IDGNR |
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THS4081, THS4082
175MHz LOW POWER HIGHSPEED AMPLIFIERS
SLOS274D DECEMBER 1999 REVISED JUNE 2001
18
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations (continued)
The actual thermal performance achieved with the THS408xDGN in its PowerPAD
package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
× 3 inches,
then the expected thermal coefficient,
θJA, is about 58.4_C/W. For comparison, the non-PowerPAD version
of the THS408x IC (SOIC) is shown. For a given
θJA, the maximum power dissipation is shown in Figure 46 and
is calculated by the following formula:
P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of THS408x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)
DGN Package
θJA = 58.4°C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θJA = 158°C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θJA = 98°C/W
TJ = 150°C
SOIC Package
Low-K Test PCB
θJA = 167°C/W
2
1.5
1
0
40
20
0
20
40
Maximum
Power
Dissipation
W
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA Free-Air Temperature °C
NOTE A: Results are with no air flow and PCB size = 3”
× 3”
Figure 46. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package. This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
相关PDF资料 |
PDF描述 |
|---|---|
| THS4081IDGN | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4081IDR | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4081ID | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4081CDG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS4081CDGNG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| THS4081IDGNRG4 | 功能描述:高速运算放大器 175-MHz Low-Power Volt-Feedback Amp RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4082 | 制造商:TI 制造商全称:Texas Instruments 功能描述:175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS |
| THS4082CD | 功能描述:高速运算放大器 Dual 175MHz RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4082CDG4 | 功能描述:高速运算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4082CDGN | 制造商:Rochester Electronics LLC 功能描述:LOW POWER, VF, DUAL OP-AMP - Bulk |
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