参数资料
型号: THS4151CDGNRG4
厂商: TEXAS INSTRUMENTS INC
元件分类: 运算放大器
英文描述: OP-AMP, 8500 uV OFFSET-MAX, PDSO8
封装: GREEN, PLASTIC, MSOP-8
文件页数: 14/32页
文件大小: 908K
代理商: THS4151CDGNRG4
www.ti.com
GENERAL PowerPAD DESIGN
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
SLOS321F – MAY 2000 – REVISED NOVEMBER 2006
PRINCIPLES OF OPERATION (continued)
The THS415x is available packaged in a thermally-enhanced DGN package, which is a member of the
PowerPAD family of packages. This package is constructed using a downset leadframe upon which the die is
mounted [see Figure 44(a) and Figure 44(b)]. This arrangement results in the lead frame being exposed as a
thermal pad on the underside of the package [see Figure 44(c)]. Because this thermal pad has direct thermal
contact with the die, excellent thermal performance can be achieved by providing a good thermal path away
from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of the
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
More complete details of the PowerPAD installation process and thermal management techniques can be
found in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package (SLMA002). This
document can be found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The
document can also be ordered through your local TI sales office. Refer to literature number SLMA002 when
ordering.
A.
The thermal pad is electrically isolated from all terminals in the package.
Figure 44. Views of Thermally Enhanced DGN Package
21
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