参数资料
型号: THS4275MDEPR
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
封装: PLASTIC, SO-8
文件页数: 12/36页
文件大小: 598K
代理商: THS4275MDEPR
THS4271EP
THS4275EP
SGLS270A DECEMBER 2004 REVISED APRIL 2005
www.ti.com
2
_
+
249
+5 V
49.9
VI
5 V
50
Source
Low-Noise, Low-Distortion, Wideband Application Circuit
NOTE: Power supply decoupling capacitors not shown
VO
249
50
THS4271
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
Supply voltage, VS
16.5 V
Input voltage, VI
±VS
Output current, IO
100 mA
Continuous power dissipation
See the Dissipation Rating Table
Maximum junction temperature, TJ
150
°C
Maximum junction temperature, continuous
operation, long term reliability TJ (2)
125
°C
Storage temperature range, Tstg
65
°C to 150°C
Lead temperature
1,6 mm (1/16 inch) from case for 10 seconds
300
°C
HBM
3000 V
ESD ratings:
CDM
1000 V
ESD ratings:
MM
100 V
(1) The absolute maximum temperature under any condition is
limited by the constraints of the silicon process. Stresses above
these ratings may cause permanent damage. Exposure to
absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only and functional
operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Long-term high-temperature storage and/or extended use at
maximum recommended operating conditions may result in a
reduction of overall device life. See Figure 1 for additional
information on thermal derating.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE DISSIPATION RATINGS
PACKAGE
θJC
θJA(1)
PACKAGE
θJC
(
°C/W)
θJA(1)
(
°C/W)
D (8 pin)
38.3
97.5
DGN (8 pin)(2)
4.7
58.4
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) The THS4271/5 may incorporate a PowerPAD
on the
underside of the chip. This acts as a heat sink and must be
connected to a thermally dissipative plane for proper power
dissipation. Failure to do so may result in exceeding the
maximum junction temperature which could permanently
damage the device. See Texas Instruments technical briefs
SLMA002 and SLMA004 for more information about utilizing the
PowerPAD thermally enhanced package.
相关PDF资料
PDF描述
THS4275MDREPR 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
THS4281DG4 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
THS4281DBVR 1 CHANNEL, VIDEO AMPLIFIER, PDSO5
THS4281DBVT 1 CHANNEL, VIDEO AMPLIFIER, PDSO5
THS4281DGKR 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
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