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参数资料
| 型号： | THS7303PWR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 3 CHANNEL, VIDEO AMPLIFIER, PDSO20 |
| 封装： | GREEN, PLASTIC, TSSOP-20 |
| 文件页数： | 12/60页 |
| 文件大小： | 1980K |
| 代理商： | THS7303PWR |
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SLOS479B
– OCTOBER 2005 – REVISED MARCH 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION (CONTINUED)
As part of the THS7303 flexibility, the 2:1 MUX input can be selected for ac- or dc-coupled inputs. The
ac-coupled modes include a sync-tip-clamp option for CVBS/Y
'/G'/B'/R' with sync or a fixed bias for the C'/P'B/P'R
non-sync channels. The dc input options include a dc input or a (dc + 135-mV) input offset shift to allow for a full
sync dynamic range at the output with 0-V input.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
TRANSPORT MEDIA, QUANTITY
THS7303PW
Rails, 70
TSSOP-20
PW
THS7303PWR
Tape and Reel, 2000
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted).
(1)
PARAMETER
UNIT
VSS
Supply voltage, VS+ to GND
5.5 V
VI
Input voltage
–0.4 V to VS+
IO
Output current
±125 mA
Continuous power dissipation
See Dissipation Ratings Table
TJ
Maximum junction temperature, any condition(2)
+150
°C
TJ
Maximum junction temperature, continuous operation, long term reliability(3)
+125
°C
Tstg
Storage temperature range
–65°C to +150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
+300
°C
HBM
2000 V
ESD ratings
CDM
750 V
MM
100 V
(1)
Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2)
The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3)
The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
POWER RATING(1)
(TJ = +125°C)
θJC
θJA
PACKAGE
(
°C/W)
(
°C/W)
TA = +25°C
TA = +85°C
TSSOP-20 (PW)
32.3
83(2)
1.2 W
0.48 W
RECOMMENDED OPERATING CONDITIONS
PARAMETER
MIN
NOM
MAX
UNIT
VSS
Supply voltage, VS+
2.7
5
V
TA
Ambient temperature
–40
+85
°C
(1)
Power rating is determined with a junction temperature of +125
°C. This is the point where distortion starts to substantially increase and
long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or
below +125
°C for best performance and reliability.
(2)
This data was taken with the JEDEC High-K test PCB. For the JEDEC low-K test PCB, the
θJA is +125.8°C.
2
Copyright
2005–2011, Texas Instruments Incorporated
Product Folder Link(s): THS7303
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