参数资料
型号: TISP5110H3BJR
厂商: Bourns Inc.
文件页数: 3/11页
文件大小: 0K
描述: SURGE SUPP -80V UNIDIR DO-214AA
标准包装: 3,000
电压 - 击穿: 110V
电压 - 断路: 80V
电压 - 导通状态: 3V
电流 - 峰值脉冲(8 x 20µs): 300A
电流 - 峰值脉冲(10 x 1000µs): 100A
电流 - 保持 (Ih): 150mA
元件数: 1
电容: 240pF
封装/外壳: DO-214AA,SMB
包装: 带卷 (TR)
TISP5xxxH3BJ Overvoltage Protection Series
Electrical Characteristics, TA = 25 ° C (Unless Otherwise Noted) (Continued)
Parameter
Test Conditions
Min Typ Max
Unit
I (BO)
V F
Breakover current
Forward voltage
dv/dt = -250 V/ms, R SOURCE = 300 ?
I F = 5 A, t W = 500 μ s
-150
-600
3
mA
V
dv/dt ≤ +1000 V/ μ s, Linear voltage ramp,
V FRM
Peak forward recovery voltage
Maximum ramp value = +500 V
di/dt = +20 A/ μ s, Linear current ramp,
5
V
Maximum ramp value = +10 A
V T
On-state voltage
I T = -5 A, t w = 500 μ s
-3
V
I H
Holding current
I T = -5 A, di/dt = +30 mA/ms
-150
-600
mA
dv/dt Critical rate of rise of off-state voltage Linear voltage ramp, maximum ramp value < 0.85V DRM
-5
kV/ μ s
I D
Off-state current
V D = -50 V
T A = 85 ° C
-10
μ A
'5070H3BJ
'5080H3BJ
'5095H3BJ
300
280
260
420
390
365
f = 1 MHz, V d = 1 V rms, V D = -1 V
'5110H3BJ
'5115H3BJ
'5150H3BJ
'5190H3BJ
'5070H3BJ
'5080H3BJ
'5095H3BJ
240
214
140
140
260
245
225
335
300
195
195
365
345
315
C O
Off-state capacitance
(see Note 6)
f = 1 MHz, V d = 1 V rms, V D = -2 V
'5110H3BJ
'5115H3BJ
'5150H3BJ
205
180
120
285
250
170
pF
'5190H3BJ
'5070H3BJ
'5080H3BJ
'5095H3BJ
120
90
80
73
170
125
110
100
f = 1 MHz, V d = 1 V rms, V D = -50 V
f = 1 MHz, V d = 1 V rms, V D = -100 V
'5110H3BJ
'5115H3BJ
'5150H3BJ
'5190H3BJ
'5150H3BJ
'5190H3BJ
65
56
35
35
30
30
90
80
50
50
40
30
NOTE:
6. Up to 10 MHz the capacitance is essentially independent of frequency. Above 10 MHz the effective capacitance is strongly
dependent on connection inductance.
Thermal Characteristics, T A = 25 ° C (Unless Otherwise Noted)
Parameter
Test Conditions
Min
Typ
Max
Unit
R θ JA
Junction to ambient thermal resistance
EIA/JESD51-3 PCB, I T = I TSM(1000)
(see Note 7)
265 mm x 210 mm populated linecard,
4-layer PCB, I T = I TSM(1000)
50
113
° C/W
NOTE:
7. EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.
JANUARY 1998 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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