参数资料
型号: TLC372Y
厂商: Texas Instruments, Inc.
元件分类: 比较器
英文描述: LinCMOSE DUAL DIFFERENTIAL COMPARATORS
中文描述: LinCMOSE双差分比较器
文件页数: 3/12页
文件大小: 183K
代理商: TLC372Y
TLC372, TLC372Q, TLC372Y
LinCMOS
DUAL DIFFERENTIAL COMPARATORS
SLCS114B – NOVEMBER 1983 – REVISED MARCH 1999
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC372Y chip information
These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression
or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6
×
3.6 MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
1OUT
1IN+
1IN–
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN+
2IN–
2OUT
(4)
GND
57
57
(3)
(2)
(7)
(8)
(1)
(5)
(6)
(4)
相关PDF资料
PDF描述
TLC374QD LinCMOSE QUADRUPLE DIFFERENTIAL COMPARATORS
TLC374MFK LinCMOSE QUADRUPLE DIFFERENTIAL COMPARATORS
TLC374MN LinCMOSE QUADRUPLE DIFFERENTIAL COMPARATORS
TLC374Q LinCMOSE QUADRUPLE DIFFERENTIAL COMPARATORS
TLC374QN LinCMOSE QUADRUPLE DIFFERENTIAL COMPARATORS
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