参数资料
型号: TLE8261-2E
厂商: Infineon Technologies
文件页数: 6/16页
文件大小: 0K
描述: IC SYSTEM BASIS CHIP DSO-36
标准包装: 1,000
类型: 收发器
应用: 自动
安装类型: 表面贴装
封装/外壳: 36-BSSOP(0.295",7.50mm 宽)裸露焊盘
供应商设备封装: PG-DSO-36
包装: 带卷 (TR)
其它名称: SP000454466
8-bit C
SBC
Embed ded P o w er
Embedded Power Product Family – Relay Driver TLE78xx
V
BAT
14
LIN-Bus
Supply Output
(hall Sensor)
Low-Side
Switch 1
Low-Side
Switch 2
wake-up
inputs
LED-Driver
Voltage
regulator
SPI
Diagnostic / Ctrl.
Watchdog
Temp. / V
BAT
Measurement I/F
LIN
16/24/32 KB
Flash
GPIOs
reset
10-bit ADC
Serial I/F
hall Sensor I/F
JTAG
E MBEDDED P O WE r is a System in a Package (SiP) solution. It incorporates an 8-bit microcontroller compatible to the
standard 8051 core with On-Chip debug Support (OCDS) and a System-Basis-Chip (SBC). The SBC is equipped with LIN / SAE J2602
compliant LIN Transceiver, low-dropout voltage regulator (LDO) as well as two low-side switches (relay driver) and supply (+ 5 V),
e.g. to supply hall sensors (TLE4966). An additional high-side driver for driving LEDs is also available.
F O r M IC r OC ONT r OLLE r supervision and additional protection of the circuit a programmable window watchdog circuit
with a reset feature, supply voltage supervision and integrated temparture sensor is implemented.
SBC, M IC r OC ONT r OLLE r AND LIN module offer power modes in order to support terminal 30 connected
automotive applications. A wake-up from the low power mode is possible via a LIN bus message or wake-up inputs.
Th IS INTE G r A TED CI r C u IT is realized as Multi-Chip-Module (MCM) in a P-DSO-28 and in P-DSO-52 package in the
future, and is designed to withstand the severe conditions of automotive and industrial applications.
Customer’s benefits:
Cost efficiency and quality
Space saving
Zero defect
Features:
8-bit Controller
8051 compatible
Flash / EEPrOM
10-bit A/D Converter
16-bit Timers
On-Chip-Debug System
Voltage regulator
LIN Transceiver
high-Side Switches (hall & SED Supply)
2 x Low-Side Switch
5 x wake-up inputs
Standard SPI Interface
08-01-16 RZ Transceiver Gesamt.indd 14
16.01.2008 12:23:46 Uhr
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