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| 型号： | TMP141AIDGKTG4 |
| 厂商： | Texas Instruments |
| 文件页数： | 17/24页 |
| 文件大小： | 662K |
| 描述： | IC TEMP SENSOR DGTL OUT 8-MSOP |
| 标准包装： | 250 |
| 系列： | SensorPath™ |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部 |
| 感应温度： | -40°C ~ 125°C |
| 精确度： | ±3°C（最小值） |
| 拓扑： | ADC（三角积分型），寄存器库 |
| 输出类型： | 1 线 SensorPath? |
| 输出警报： | 无 |
| 输出风扇： | 无 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 带卷 (TR) |
PACKAGE OPTION ADDENDUM
www.ti.com
14-Nov-2013
Addendum-Page 2
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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