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参数资料
型号： TMS320C6415TBZLZ8
厂商： TEXAS INSTRUMENTS INC
元件分类： 数字信号处理
英文描述： 64-BIT, 75.18 MHz, OTHER DSP, PBGA532
封装： 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532
文件页数： 40/142页
文件大小： 2106K
代理商： TMS320C6415TBZLZ8
TMS320C6414T, TMS320C6415T, TMS320C6416T
FIXEDPOINT DIGITAL SIGNAL PROCESSORS
SPRS226M NOVEMBER 2003 REVISED APRIL 2009
134
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
MECHANICAL DATA FOR C6414T, C6415T, AND C6416T
The following table(s) show the thermal resistance characteristics for the PBGA — GLZ, ZLZ and CLZ
mechanical packages.
thermal resistance characteristics (S-PBGA package) [GLZ]
NO.
Air Flow (m/s)
°C/W
(with Heat Sink§)
1
R
ΘJC
Junction-to-case
N/A
3.11
2
R
ΘJB
Junction-to-board
N/A
9.95
3
R
ΘJA
Junction-to-free air
0.00
19.6
14.4
4
R
ΘJA
Junction-to-free air
0.5
17.3
11.5
5
R
ΘJA
Junction-to-free air
1.0
15.6
9.3
6
R
ΘJA
Junction-to-free air
2.00
14.7
8.0
7
PsiJT
Junction-to-package top
N/A
0.83
8
PsiJB
Junction-to-board
N/A
7.88
m/s = meters per second
Numbers are based on simulations.
§ These thermal resistance numbers were modeled using a heat sink, part number 374024B00035, manufactured by AAVID Thermalloy. AAVID
Thermalloy also manufactures a similar epoxy-mounted heat sink, part number 374024B00000. When operating at 1 GHz, a heat sink is
required to reduce the thermal resistance characteristics of the package. TI recommends a passive, laminar heat sink, similar to the part
numbers mentioned above.
thermal resistance characteristics (S-PBGA package) [ZLZ]
NO.
Air Flow (m/s)
°C/W
(with Heat Sink§)
1
R
ΘJC
Junction-to-case
N/A
3.11
2
R
ΘJB
Junction-to-board
N/A
9.95
3
R
ΘJA
Junction-to-free air
0.00
19.6
14.4
4
R
ΘJA
Junction-to-free air
0.5
17.3
11.5
5
R
ΘJA
Junction-to-free air
1.0
15.6
9.3
6
R
ΘJA
Junction-to-free air
2.00
14.7
8.0
7
PsiJT
Junction-to-package top
N/A
0.83
8
PsiJB
Junction-to-board
N/A
7.88
m/s = meters per second
Numbers are based on simulations.
§ These thermal resistance numbers were modeled using a heat sink, part number 374024B00035, manufactured by AAVID Thermalloy. AAVID
Thermalloy also manufactures a similar epoxy-mounted heat sink, part number 374024B00000. When operating at 1 GHz, a heat sink is
required to reduce the thermal resistance characteristics of the package. TI recommends a passive, laminar heat sink, similar to the part
numbers mentioned above.
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