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| 型号： | TNY264GN-TL |
| 厂商： | Power Integrations |
| 文件页数： | 13/22页 |
| 文件大小： | 0K |
| 描述： | IC OFFLINE SWIT OTP OCP HV 8SMD |
| 标准包装： | 1 |
| 输出隔离： | 隔离 |
| 频率范围： | 124kHz ~ 140kHz |
| 输出电压： | 700V |
| 功率（瓦特）： | 9W |
| 工作温度： | -40°C ~ 150°C |
| 封装/外壳： | 8-SMD（7 个接脚），鸥形翼 |
| 供应商设备封装： | SMD-8B |
| 包装： | 标准包装 |
| 产品目录页面： | 1203 (CN2011-ZH PDF) |
| 其它名称： | 596-1046-6 |
TNY263-268
Absolute Maximum Ratings (1,4)
DRAIN Voltage .................................. ................ -0.3 V to 700 V
DRAIN Peak Current: TNY263......................................400 mA
TNY264.....................................400 mA
.................................... TNY265......................................440 mA
TNY266.....................................560 mA
.................................... TNY267.....................................720 mA
TNY268.....................................880 mA
EN/UV Voltage ....................................................... -0.3 V to 9 V
EN/UV Current............................................................... 100 mA
BYPASS Voltage .................................................. .. -0.3 V to 9 V
Storage Temperature ....................................... -65 °C to 150 °C
Thermal Impedance
Thermal Impedance: P or G Package:
( θ JA ) ........................... 70 °C/W (2) ; 60 °C/W (3)
( θ JC ) (1) ............................................... 11 °C/W
Operating Junction Temperature (2) .................... -40 °C to 150 °C
Lead Temperature (3) ....................................................... ..260 °C
Notes:
1. All voltages referenced to SOURCE, T A = 25 °C.
2. Normally limited by internal circuitry.
3. 1/16 in. from case for 5 seconds.
4. Maximum ratings speci?ed may be applied one at a time,
without causing permanent damage to the product.
Exposure to Absolute Maximum Rating conditions for
extended periods of time may affect product reliability.
Notes:
1. Measured on the SOURCE pin close to plastic interface.
2. Soldered to 0.36 sq. in. (232 mm 2 ), 2 oz. (610 g/m 2 ) copper clad.
3. Soldered to 1 sq. in. (645 mm 2 ), 2 oz. (610 g/m 2 ) copper clad.
Conditions
Parameter
Symbol
SOURCE = 0 V; T J = -40 to 125 °C
See Figure 18
Min
Typ
Max
Units
(Unless Otherwise Speci?ed)
Control Functions
Output Frequency
f OSC
T J = 25 °C
See Figure 4
Average
Peak-Peak Jitter
124
132
8
140
kHz
Maximum Duty Cycle
EN/UV Pin Turnoff
Threshold Current
EN/UV Pin Voltage
DC MAX
I DIS
V EN
I S1
S1 Open
T J = -40 °C to 125 °C
I EN/UV = -125 μ A
I EN/UV = 25 μ A
V EN/UV = 0 V
62
-300
0.4
1.3
65
-240
1.0
2.3
430
68
-170
1.5
2.7
500
%
μ A
V
μ A
TNY263
200
250
DRAIN Supply Current
I S2
EN/UV Open
(MOSFET
Switching)
TNY264
TNY265
TNY266
225
245
265
270
295
320
μ A
See Note A, B
TNY267
TNY268
315
380
380
460
V BP = 0 V,
TNY263-264
-5.5
-3.3
-1.8
BYPASS Pin Charge
Current
I CH1
I CH2
T J = 25 °C
See Note C, D
V BP = 4 V,
T J = 25 °C
See Note C, D
TNY265-268
TNY263-264
TNY265-268
-7.5
-3.8
-4.5
-4.6
-2.0
-3.0
-2.5
-1.0
-1.5
mA
13
www.powerint.com
Rev. H 02/09
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