参数资料
型号: TPA3100D2PHPR
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: 21.8 W, 2 CHANNEL, AUDIO AMPLIFIER, PQFP48
封装: 9 X 9 MM, GREEN, PLASTIC, HTQFP-48
文件页数: 38/41页
文件大小: 1191K
代理商: TPA3100D2PHPR
SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010
www.ti.com
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
QFN
HTQFP
NAME
NO.
ROUTP
41, 42
O
Class-D 1/2-H-bridge positive output for right channel.
PVCCR
34, 35
Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
BSRP
43
I/O
Bootstrap I/O for right channel, positive high-side FET.
AGND
4, 17
Analog ground for digital/analog cells in core.
ROSC
14
I/O
I/O for current setting resistor of ramp generator.
Master/Slave select for determining direction of SYNC terminal.
HIGH=Master mode, SYNC terminal is an output; LOW = slave mode,
MSTR/SLV
10
I
SYNC terminal accepts a clock input. TTL logic levels with compliance to
VREG.
Clock input/output for synchronizing multiple class-D devices. Direction
SYNC
11
I/O
determined by MSTR/SLV terminal. Input signal not to exceed VREG.
Reference for preamplifier. Nominally equal to 1.25 V. Also controls start-up
VBYP
16
O
time via external capacitor sizing.
4-V regulated output for use by internal cells, GAINx, MUTE, and
VREG
15
O
MSTR/SLV pins only. Not specified for driving other external circuitry.
High-voltage analog power supply. Not internally connected to PVCCR or
AVCC
48
47, 48
PVCCL.
1, 7, 12,
NC
13, 24, 25,
Not internally connected.
36, 37, 47
Connect to AGND and PGND – should be star point for both grounds.
Internal resistive connection to AGND and PGND. Thermal vias on the PCB
Thermal Pad
-
should connect this pad to a large copper area on an internal or bottom
layer for the best thermal performance. The Thermal Pad must be soldered
to the PCB for mechanical reliability.
6
Copyright 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TPA3100D2
相关PDF资料
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TPA3100D2RGZRG4 21.8 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC48
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