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参数资料
| 型号： | TPD4S014DSQR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO10 |
| 封装： | 0.40 MM PITCH, PLASTIC, WSON-10 |
| 文件页数： | 9/15页 |
| 文件大小： | 676K |
| 代理商： | TPD4S014DSQR |
SLVSAU0A
– MAY 2011 – REVISED JUNE 2011
PIN FUNCTIONS
PIN
TYPE
DESCRIPTION
NAME
NO.
D
–
6
I/O
USB data
–
D+
7
I/O
USB data+
ID
5
I/O
USB ID signal
Open-Drain Adapter-Voltage Indicator Output. ACOK is driven low after the VIN voltage is stable
ACK
4
O
between UVLO and OVLO for 16ms (typ). Connect a pullup resistor from ACOK to the logic I/O
voltage of the host system.
EN
3
I
Enable Active-Low Input. Drive EN low to enable the switch. Drive EN high to disable the switch.
VBUS
9, 10
USB Input
USB connector VBUS
Power
VCC
1, 2
Power Output Connect to PCB internal PCB plane
GND
8
Ground
Connect to PCB ground plane
Central
Heat Sink
Electrically disconnected. Use as heat sink. Connect to GND plane via large PCB PAD
PAD
ABSOLUTE MAXIMUM RATINGS
(1) (2)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
MAX
Max Voltage on VBUS
–0.5
30
V
Continuous current through NFET
2.6
A
Max Current through D+, D-, ID, VBUS ESD clamps
-50
mA
Continuous current through logic output
–50
50
mA
Maximum junction temperature
–40
150
°C
IEC 61000-4-2 Contact Discharge
D+, D
–, ID, VBUS pins
±15
kV
IEC 61000-4-2 Air-gap Discharge
D+, D
–, ID, VBUS pins
±15
kV
Human-Body Model
EN, ACK, VCC pins
±2
kV
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2)
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
THERMAL INFORMATION
TPD4S014
THERMAL METRIC(1)
UNITS
DSQ (10) PINS
θJA
Junction-to-ambient thermal resistance
70.3
θJCtop
Junction-to-case (top) thermal resistance
46.3
θJB
Junction-to-board thermal resistance
33.8
°C/W
ψJT
Junction-to-top characterization parameter
2.9
ψJB
Junction-to-board characterization parameter
33.5
θJCbot
Junction-to-case (bottom) thermal resistance
16.3
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright
2011, Texas Instruments Incorporated
3
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