参数资料
型号: TPS2000CDGN
厂商: TEXAS INSTRUMENTS INC
元件分类: 模拟信号调理
英文描述: SPECIALTY ANALOG CIRCUIT, PDSO8
封装: PLASTIC, MSOP-8
文件页数: 12/28页
文件大小: 1476K
代理商: TPS2000CDGN
SLVSAU6B
– JUNE 2011 – REVISED SEPTEMBER 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE INFORMATION(1)
PACKAGED DEVICE(2)
MAXIMUM
OUTPUT
BASE PART
OPERATING
ENABLE
MSOP-8 (DGN)
SOT23-5
MSOP-8
DISCHARGE
NUMBER
CURRENT
PowerPAD
(DBV)
(DGK)
0.5
Y
High
TPS2051C
VBYQ
1
Y
High
TPS2065C
VCAQ
1.5
Y
High
TPS2069C
VBUQ
2
Y
Low
TPS2000C
BCMS
PXF1
2
Y
High
TPS2001C
VBWQ
PXG1
(1)
For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2)
"-" indicates the device is not available in this package.
ABSOLUTE MAXIMUM RATINGS
(1) (2)
VALUE
UNIT
MIN
MAX
Voltage range on IN, OUT, EN or EN, FLT (3)
–0.3
6
V
Voltage range from IN to OUT
–6
6
V
Maximum junction temperature, TJ
Internally Limited
HBM
2
kV
Electrostatic Discharge
CDM
500
V
IEC 61000-4-2, Contact / Air (4)
8
15
kV
(1)
Absolute maximum ratings apply over recommended junction temperature range.
(2)
Voltages are with respect to GND unless otherwise noted.
(3)
(4)
VOUT was surged on a pcb with input and output bypassing per Figure 1 (except input capacitor was 22 F) with no device failures.
THERMAL INFORMATION
0.5 A or 1 A
1.5 A or 2 A
0.5 A or 1 A
1.5 A or 2 A
2 A
Rated
THERMAL METRIC(1)
UNITS
(See DEVICE INFORMATION table.)
DBV
DGN
DGK
5 PINS
8 PINS
θJA
Junction-to-ambient thermal resistance
224.9
220.4
72.1
67.1
205.5
θJCtop
Junction-to-case (top) thermal
95.2
89.7
87.3
80.8
94.3
resistance
θJB
Junction-to-board thermal resistance
51.4
46.9
42.2
37.2
126.9
ψJT
Junction-to-top characterization
6.6
5.2
7.3
5.6
24.7
parameter
°C/W
ψJB
Junction-to-board characterization
50.3
46.2
42.0
36.9
125.2
parameter
θJCbot
Junction-to-case (bottom) thermal
N/A
39.2
32.1
N/A
resistance
θJACustom
139.3
134.9
66.5
61.3
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Copyright
2011, Texas Instruments Incorporated
Product Folder Link(s) :TPS20xxC
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