TPS2014, TPS2015
POWER DISTRIBUTION SWITCHES
SLVS159C DECEMBER 1996 REVISED MARCH 2004
17
TI.COM
APPLICATION INFORMATION
power dissipation and junction temperature
The low on-resistance of the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass
large currents. The thermal resistance of these packages is high compared to that of power packages; it is good
design practice to check power dissipation and junction temperature. The first step is to find ron at the input
voltage and at the operating temperature. As an initial estimate, use the highest operating ambient temperature
of interest and read ron from Figure 17. Next calculate the power dissipation using:
P
D +
ron
I2
Finally, calculate the junction temperature:
Where:
TA = Ambient temperature
RθJA = Thermal resistance SOIC = 172°C/W, P = 106°C/W
T
J +
P
D
RqJA ) TA
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
thermal protection
Thermal protection is provided to prevent damage to the IC when heavy-overload or a short-circuit fault is
present for an extended period of time. The fault forces the TPS20xx into constant current mode, which causes
the voltage across the high-side switch to increase. Under short-circuit conditions, the voltage across the switch
is equal to the input voltage. The increased dissipation causes the junction temperature to rise to dangerously
high levels. The protection circuit senses the junction temperature of the switch and shuts it off. The switch
remains off until the junction temperature has dropped approximately 20
°C. The switch continues to cycle in
this manner until the load fault or the input power is removed.
undervoltage lockout
An undervoltage lockout is provided to ensure that the power switch is in the off state at power up. Whenever
the input voltage falls below approximately 3.2 V, the power switch quickly turns off. This facilitates the design
of hot-insertion systems that may not have the ability to turn off the power switch before input power is removed.
Upon reapplication of the input voltage (if enabled), the power switch turns on with a controlled rise time to
reduce inrush current, EMI, and voltage overshoots.
For proper operation of the UVLO, the TPS20xx requires the voltage decay from 3 V to 2 V to take at least
200
s. Capacitance is added to the input or output of the TPS20xx to increase this decay rate. Capacitance
is generally added to the output to lower inrush current due to input capacitance.
Universal Serial Bus (USB) applications
The USB specification provides for five different classes of devices based on their power sourcing and sinking
requirements. These classes of devices are: bus-powered hub, self-powered hub, lower power bus-powered
function, high power bus-powered function, and self-powered functions. The TPS20xx can provide power
distribution solutions for many of these devices.