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参数资料
| 型号： | TPS61170DRVTG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | 1.44 A SWITCHING REGULATOR, 1500 kHz SWITCHING FREQ-MAX, PDSO6 |
| 封装： | 2 X 2 MM, GREEN, PLASTIC, SON-6 |
| 文件页数： | 24/29页 |
| 文件大小： | 689K |
| 代理商： | TPS61170DRVTG4 |
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VIN
CTRL
SW
FB
COMP
GND
TOP VIEW
Thermal
Pad
6-PIN2mmx2mmx0.8mmQFN
SLVS789C
– NOVEMBER 2007 – REVISED APRIL 2011
ELECTRICAL CHARACTERISTICS (continued)
VIN = 3.6 V, CTRL = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EasyScale TIMING
tstart
Start time of program stream
2
μs
tEOS
End time of program stream
2
360
μs
tH_LB
High time low bit
Logic 0
2
180
μs
tL_LB
Low time low bit
Logic 0
2
× tH_LB
360
μs
tH_HB
High time high bit
Logic 1
2
× tL_HB
360
μs
tL_HB
Low time high bit
Logic 1
2
180
μs
VACKNL
Acknowledge output voltage low
Open drain, Rpullup =15 k to Vin
0.4
V
tvalACKN
Acknowledge valid time
See (2)
2
μs
tACKN
Duration of acknowledge condition
See (2)
512
μs
THERMAL SHUTDOWN
Tshutdown
Thermal shutdown threshold
160
°C
Thysteresis
Thermal shutdown threshold hysteresis
15
°C
(2)
Acknowledge condition active 0, this condition will only be applied if the RFA bit is set. Open drain output, line needs to be pulled high
by the host with resistor load.
PIN ASSIGNMENTS
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
VIN
6
I
The input supply pin for the IC. Connect VIN to a supply voltage between 3 V and 18 V.
SW
4
I
This is the switching node of the IC. Connect SW to the switched side of the inductor.
GND
3
O
Ground
FB
1
I
Feedback pin for current. Connect to the center tap of a resistor divider to program the output voltage.
Output of the transconductance error amplifier. Connect an external RC network to this pin to compensate
COMP
2
O
the regulator.
Control pin of the boost regulator. CTRL is a multi-functional pin which can be used to enable the device
CTRL
5
I
and control the feedback voltage with a PWM signal or for digital communications.
The thermal pad should be soldered to the analog ground plane to avoid thermal issue. If possible, use
Thermal Pad
thermal vias to connect to ground plane for ideal power dissipation.
4
Copyright
2007–2011, Texas Instruments Incorporated
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