参数资料
型号: TPS62125EVM-044
厂商: Texas Instruments
文件页数: 2/38页
文件大小: 0K
描述: EVAL MODULE FOR TPS62125-044
标准包装: 1
系列: DCS-Control™
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 3.3V
电流 - 输出: 300mA
输入电压: 4 ~ 17 V
稳压器拓扑结构: 降压
板类型: 完全填充
已供物品:
已用 IC / 零件: TPS62125

SLVSAQ5C – MARCH 2012 – REVISED DECEMBER 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
–40°C to 85°C
PART NUMBER (1)
TPS62125
TPS62126 (2)
V OUT
adjustable
1.8V
PACKAGE MARKING
SAQ
TBD
(1)
(2)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com
samples available, contact TI for further information
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
VALUE
MAX
UNIT
VIN
SW
- 0.3
- 0.3
20
20
V
V
Pin voltage range
Power Good sink
(2)
EN
FB
VOS, PG
EN_hys
I PG
- 0.3
– 0.3
- 0.3
– 0.3
V IN +0.3V
3.6
12
7
10
V
V
V
V
mA
current
EN_hys sink current
I EN_hys
3
ESD rating (3)
HBM Human body model
CDM Charge device model
Machine model
2
1
100
kV
V
Maximum operating junction temperature, T J
Storage temperature range, T stg
–40
–65
125
150
°C
°C
(1)
(2)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal GND.
The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
THERMAL INFORMATION
TPS62125
THERMAL METRIC (1)
DSG
8 PINS
UNITS
θ JA
θ JC(top)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
65.2
93.3
θ JB
ψ JT
ψ JB
θ JC(bottom)
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
30.1
0.5
47.4
7.2
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC PackageThermal Metrics application report, SPRA953
2
Product Folder Links : TPS62125
Copyright ? 2012–2013, Texas Instruments Incorporated
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