参数资料
型号: TPS63061DSCR
厂商: Texas Instruments
文件页数: 22/32页
文件大小: 0K
描述: IC REG BUCK BST SYNC 5V 1A 10SON
标准包装: 1
类型: 降压(降压),升压(升压)
输出类型: 固定
输出数: 1
输出电压: 5V
输入电压: 2.5 V ~ 12 V
PWM 型: 电流模式
频率 - 开关: 2.4MHz
电流 - 输出: 1A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-WFQFN 裸露焊盘
包装: 标准包装
供应商设备封装: 10-SON 裸露焊盘(3x3)
其它名称: 296-30205-6
SLVSA92A – DECEMBER 2011 – REVISED FEBRUARY 2012
LAYOUT CONSIDERATIONS
For all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, short traces are recommended as well, separation from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground
current.
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
?
?
?
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB by soldering the PowerPAD ?
Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal
22
Copyright ? 2011 – 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS63060 TPS63061
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