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参数资料
| 型号： | TPS65563ARGTT |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 电源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC16 |
| 封装： | 3 X 3 MM, GREEN, PLASTIC, QFN-16 |
| 文件页数： | 12/18页 |
| 文件大小： | 745K |
| 代理商： | TPS65563ARGTT |
ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
DISSIPATION RATINGS
www.ti.com......................................................................................................................................................... SLVS858A – JULY 2008 – REVISED AUGUST 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
over operating free-air temperature range (unless otherwise noted)
UNIT
VCC, IGBT_VCC
–0.6 to 6
Supply voltage range
V
VBAT
–0.6 to 13
Vo
Output voltage range of XFULL
–0.6 to 6
V
VSW
Switch terminal voltage range
–0.6 to 50
V
ISW
Switch current between SW and GND
3
A
VI
Input voltage range
CHG, I_PEAK, F_ON, F_EN
–0.3 to VCC
V
Tstg
Storage temperature range
–40 to 150
°C
TJ
Maximum junction temperature
125
°C
ESD rating Human Body Model (HBM) JES22-A114
1.5
kV
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
MIN
MAX
UNIT
VCC, IGBT_VCC
2.7
5.5
Supply voltage
V
VBAT
1.4
12
VSW
Switch terminal voltage
–0.3
45
V
ISW
Switch current between SW and GND
2.3
A
VIH
High-level digital input voltage at CHG, F_ON, and F_EN
2.0
V
VIL
Low-level digital input voltage at CHG, F_ON, and F_EN
0.6
V
Operating free-air temperature
–35
85
°C
POWER RATINGS
POWER RATINGS RATE
PACKAGE
RθJA
(1)
TA < 25°C
TA = 85°C
QFN
47.4°C/W
2.11 W
0.844 W
(1)
The thermal resistance, RθJA, is based on a soldered PowerPAD package on a 2S2P JEDEC board using thermal vias.
Copyright 2008, Texas Instruments Incorporated
3
Product Folder Link(s): TPS65563A
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