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| 型号： | TPS81256SIPT |
| 厂商： | Texas Instruments |
| 文件页数： | 17/26页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST SYNC 5V 0.6A 9USIP |
| 标准包装： | 250 |
| 类型： | 升压（升压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 5V |
| 输入电压： | 2.5 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 4MHz |
| 电流 - 输出： | 600mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | * |
| 封装/外壳： | * |
| 包装： | * |
| 供应商设备封装： | * |
| 其它名称： | 296-34854-2 |
SLVSAZ9A – JUNE 2012 – REVISED AUGUST 2013
LAYOUT CONSIDERATION
In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 23 shows the appropriate diameters for a MicroSiP TM
layout.
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Solder Mask Thickness
Copper Trace Thickness
M0200-01
Figure 23. Recommended Land Pattern Image and Dimensions
SOLDER PAD
DEFINITIONS
Non-solder-mask
defined (NSMD)
COPPER PAD
0.30mm
SOLDER MASK
OPENING
0.360mm
COPPER
THICKNESS
1oz max (0.032mm)
STENCIL
OPENING
0.34mm diameter
STENCIL THICKNESS
0.1mm thick
SURFACE MOUNT INFORMATION
The TPS8125x MicroSiP? DC/DC converter uses an open frame construction that is designed for a fully
automated assembly process and that features a large surface area for pick and place operations. See the "Pick
Area" in the package drawings.
Package height and weight have been kept to a minimum thereby to allow the MicroSiP? device to be handled
similarly to a 0805 component.
See JEDEC/IPC standard J-STD-20b for reflow recommendations.
Copyright ? 2012–2013, Texas Instruments Incorporated
Product Folder Links: TPS81256
17
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