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参数资料
| 型号： | TPS82678SIP |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | 0.6 A SWITCHING REGULATOR, 6000 kHz SWITCHING FREQ-MAX, BGA8 |
| 封装： | 2.30 X 2.90 MM, 1 MM HEIGHT, LEAD FREE, USIP-8 |
| 文件页数： | 14/28页 |
| 文件大小： | 943K |
| 代理商： | TPS82678SIP |
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C2
B2
A2
C1
B1
D
E
A1
C3
A3
TOP VIEW
BOTTOM VIEW
YML
A1
LSB
CC
SLVSAI0A
– OCTOBER 2010 – REVISED APRIL 2011
THERMAL INFORMATION
The die temperature of the TPS8267x must be lower than the maximum rating of 125
°C, so care should be taken
in the layout of the circuit to ensure good heat sinking of the TPS8267x.
To estimate the junction temperature, approximate the power dissipation within the TPS8267x by applying the
typical efficiency stated in this datasheet to the desired output power; or, by taking a power measurement if you
have an actual TPS8267x device and TPS82671EVM evaluation module. Then calculate the internal temperature
rise of the TPS8267x above the surface of the printed circuit board by multiplying the TPS8267x power
dissipation by the thermal resistance.
The actual thermal resistance of the TPS8267x to the printed circuit board depends on the layout of the circuit
board, but the thermal resistance given in the Thermal Information Table can be used as a guide.
Three basic approaches for enhancing thermal performance are listed below:
Improve the power dissipation capability of the PCB design.
Improve the thermal coupling of the component to the PCB.
Introduce airflow into the system.
PACKAGE SUMMARY
SIP PACKAGE
Code:
CC
— Customer Code (device/voltage specific)
YML
— Y: Year, M: Month, L: Lot trace code
LSB
— L: Lot trace code, S: Site code, B: Board locator
MicroSiP
TM DC/DC MODULE PACKAGE DIMENSIONS
The TPS8267x device is available in an 8-bump ball grid array (BGA) package. The package dimensions are:
D = 2.30
±0.05 mm
E = 2.90
±0.05 mm
REFERENCES
"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE
TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by
Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David Gonz
ález, Javier Gago.
Copyright
2010–2011, Texas Instruments Incorporated
21
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TPS8267XEVM | 制造商:TI 制造商全称:Texas Instruments 功能描述:The TPS82671 and TPS82675 devices are series of high-frequency, synchronous, step-down dc-dc converters optimized for battery-powered portable applications |
| TPS8268090SIPT | 功能描述:Buck Switching Regulator IC Positive Fixed 0.9V 1 Output 1.6A 9-SMD Module 制造商:texas instruments 系列:- 包装:剪切带（CT） 零件状态:有效 功能:降压 输出配置:正 拓扑:降压 输出类型:固定 输出数:1 电压 - 输入（最小值）:2.5V 电压 - 输入（最大值）:5.5V 电压 - 输出（最小值/固定）:0.9V 电压 - 输出（最大值）:- 电流 - 输出:1.6A 频率 - 开关:5.5MHz 同步整流器:是 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:9-SMD 模块 供应商器件封装:9-USIP 标准包装:1 |
| TPS8268105SIPT | 功能描述:Buck Switching Regulator IC Positive Fixed 1.05V 1 Output 1.6A 9-SMD Module 制造商:texas instruments 系列:- 包装:剪切带（CT） 零件状态:有效 功能:降压 输出配置:正 拓扑:降压 输出类型:固定 输出数:1 电压 - 输入（最小值）:2.5V 电压 - 输入（最大值）:5.5V 电压 - 输出（最小值/固定）:1.05V 电压 - 输出（最大值）:- 电流 - 输出:1.6A 频率 - 开关:5.5MHz 同步整流器:是 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:9-SMD 模块 供应商器件封装:9-USIP 标准包装:1 |
| TPS8268120SIPR | 功能描述:Buck Switching Regulator IC Positive Fixed 1.2V 1 Output 1.6A 9-VBGA 制造商:texas instruments 系列:- 包装:剪切带（CT） 零件状态:有效 功能:降压 输出配置:正 拓扑:降压 输出类型:固定 输出数:1 电压 - 输入（最小值）:2.5V 电压 - 输入（最大值）:5.5V 电压 - 输出（最小值/固定）:1.2V 电压 - 输出（最大值）:- 电流 - 输出:1.6A 频率 - 开关:5.5MHz 同步整流器:是 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:9-VBGA 供应商器件封装:9-USIP 标准包装:1 |
| TPS8268120SIPT | 功能描述:Buck Switching Regulator IC Positive Fixed 1.2V 1 Output 1.6A 9-VBGA 制造商:texas instruments 系列:- 包装:剪切带（CT） 零件状态:有效 功能:降压 输出配置:正 拓扑:降压 输出类型:固定 输出数:1 电压 - 输入（最小值）:2.5V 电压 - 输入（最大值）:5.5V 电压 - 输出（最小值/固定）:1.2V 电压 - 输出（最大值）:- 电流 - 输出:1.6A 频率 - 开关:5.5MHz 同步整流器:是 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:9-VBGA 供应商器件封装:9-USIP 标准包装:1 |
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