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参数资料
| 型号： | TRA3225 |
| 厂商： | ON Semiconductor |
| 文件页数： | 7/8页 |
| 文件大小： | 71K |
| 描述： | DIODE 250V 32A MICRODE BUTTON |
| 产品变化通告： | Product Discontinuation 02/Jan/2007 |
| 标准包装： | 5,000 |
| 二极管类型： | 标准 |
| 电压 - (Vr)（最大）： | 250V |
| 电流 - 平均整流 (Io)： | 32A |
| 电压 - 在 If 时为正向 (Vf)（最大）： | 1.15V @ 100A |
| 速度： | 标准恢复 >500ns，> 200mA（Io） |
| 电流 - 在 Vr 时反向漏电： | 20µA @ 250V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | Microde 按钮 |
| 供应商设备封装： | Microde 按钮 |
| 包装： | 散装 |
TRA3225
http://onsemi.com
7
Button holding fixtures for use during soldering may be
of various materials. Stainless steel has a longer use life
while black anodized aluminum is less expensive and will
limit heat reflection and enhance absorption. The assembly
volume will influence the choice of materials. Fixture
dimension tolerances for locating the button must allow for
expansion during soldering as well as allowing for button
clearance.
Heating Techniques
The following four heating methods have their
advantages and disadvantages depending on volume of
buttons to be soldered.
1.
Belt furnaces
readily handle large or small
volumes and are adaptable to establishment of
aon±line'' assembly since a variable belt speed sets
the run rate. Individual furnace zone controls make
excellent temperature control possible.
2.
Flame Soldering
involves the directing of natural
gas flame jets at the base of a heatsink as the
heatsink is indexed to various loading±heating±
cooling±unloading positions. This is the most
economical labor method of soldering large
volumes. Flame soldering offers good temperature
control but requires sophisticated temperature
monitoring systems such as infrared.
3.
Ovens
are good for batch soldering and are
production limited. There are handling problems
because of slow cooling. Response time is load
dependent, being a function of the watt rating of the
oven and the mass of parts. Large ovens may not
give an acceptable temperature gradient. Capital
cost is low compared to belt furnaces and flame
soldering.
4.
Hot Plates are good for soldering small quantities
of prototype devices. Temperature control is fair
with overshoot common because of the exposed
heating surface. Solder flow and positioning can be
corrected during soldering since the assembly is
exposed. Investment cost is very low.
Regardless of the heating method used, a soldering profile
giving the time±temperature relationship of the particular
method must be determined to assure proper soldering.
Profiling must be performed on a scheduled basis to
minimize poor soldering. The time±temperature
relationship will change depending on the heating method
used.
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| UF1507S-T | DIODE ULT FAST 1.5A 1000V DO-41 |
| UF2006-T | DIODE ULT FAST 2A 800V DO-15 |
| UF3007-T | DIODE ULT FAST 3A 1000V DO-201AD |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TRA3225/D | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Medium-Current Silicon Rectifier |
| TRA3-2411 | 制造商:Traco Power 功能描述:DC/DC converter,Isolated,5V,600mA,3W |
| TRA3-2412 | 制造商:Traco Power 功能描述:DC/DC converter,Isolated,12V,250mA,3W |
| TRA3-2413 | 制造商:Traco Power 功能描述:DC/DC converter,Isolated,15V,200mA,3W |
| TRA3-2419 | 制造商:Traco Power 功能描述:DC/DC converter,Isolated,9V,333mA,3W |
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