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| 型号： | TRF3702IRHCG4 |
| 厂商： | Texas Instruments |
| 文件页数： | 6/39页 |
| 文件大小： | 0K |
| 描述： | IC QUADRATURE MODULATOR 16-VQFN |
| 产品培训模块： | RFID Technology and Applications |
| 标准包装： | 92 |
| 功能： | 调制器 |
| LO 频率： | 1.5GHz ~ 2.5GHz |
| RF 频率： | 1.5GHz ~ 2.5GHz |
| P1dB： | 7dBm |
| 底噪： | -155dBm/Hz |
| 输出功率： | -2.5dBm |
| 电流 - 电源： | 170mA |
| 电源电压： | 4.5 V ~ 5.5 V |
| 测试频率： | 1.842GHz |
| 封装/外壳： | 16-VQFN 裸露焊盘 |
| 包装： | 管件 |
| 配用： | TRF3702EVM-ND - TRF3702EVM |
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TRF3702
www.ti.com
SLWS149A – SEPTEMBER 2004 – REVISED AUGUST 2006
RF OUTPUT PERFORMANCE
Over recommended operating conditions, VCC = 5 V, VCM = 3.7 V, f LO = 2.1 GHz at 0 dBm (unless otherwise specified)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Single and Two-Tone Specifications
Output power
–5
–3
dBm
Second baseband harmonic
(USB or LSB) (2)
Third baseband harmonic
(USB or LSB) (2)
IMD 3
P1dB (output compression
point)
I, Q (1) = 1 Vp-p, f BB = 928 kHz
I, Q (1) = 1 Vp-p, fBB = 928 kHz (two-tone signal,
f BB1 = 928 kHz, f BB2 = 992 kHz)
–50
–60
–55
7
–42
–51
–47
dBc
dBc
dBc
dBm
NSD
Noise spectral density
WCDMA ACPR
impedance (4)
RFOUT pin
60-MHz offset from carrier, P out = 0 dBm, over temperature
Single carrier, channel power = –14 dBm
–151
71
35 + j27
–148.5 (3) dBm/Hz
dBc
?
I, Q (1) = 1 Vp-p, f BB = 928 kHz, unadjusted
30
Carrier suppression
Sideband suppression
I, Q (1) = 1 Vp-p, f BB = 928 kHz, optimized
I, Q (1) = 1 Vp-p, f BB = 928 kHz, over temperature (5)
I, Q (1) = 1 Vp-p, f BB = 928 kHz, unadjusted
I, Q (1) = 1 Vp-p, f BB = 928 kHz, optimized
I, Q (1) = 1 Vp-p, f BB = 928 kHz, over temperature (5)
55
47
37
55
47
dBc
dBc
(1)
(2)
(3)
(4)
(5)
I , Q = 1 Vp-p implies that the magnitude of the signal at each input pin IVIN, IREF, QVIN, QREF is equal to 500 mVp-p.
USB = upper sideband. LSB = lower sideband.
Maximum noise values are assured by statistical characterization only, not production testing. The values specified are over the entire
temperature range, T A = –40 ° C to 85 ° C.
For a listing of impedances at various frequencies, see Table 1 .
After optimization at room temperature. See the Definitions of Selected Specifications section.
THERMAL CHARACTERISTICS
PARAMETER
CONDITION
NOM
UNIT
R θ JA
R θ JM
R θ JC
Thermal resistace, junction to ambient
Thermal resistace, junction to mounting
surface
Thermal resistace, junction to case
Soldered pad using four-layer JEDEC board with four thermal vias
Soldered pad using two-layer JEDEC board with four thermal vias
42.8
24.8
67.6
° C/W
° C/W
° C/W
DEFINITIONS OF SELECTED SPECIFICATIONS
Unadjusted Carrier Suppression
This specification measures the amount by which the local oscillator component is attenuated in the output
spectrum of the modulator relative to the carrier. It is assumed that the baseband inputs delivered to the pins of
the TRF3702 are perfectly matched to have the same dc offset (VCM). This includes all four baseband inputs:
IVIN, QVIN, IREF and QREF. Unadjusted carrier suppression is measured in dBc.
Adjusted (Optimized) Carrier Suppression
This differs from the unadjusted suppression number in that the dc offsets of the baseband inputs are iteratively
adjusted around their theoretical value of VCM to yield the maximum suppression of the LO component in the
output spectrum. Adjusted carrier suppression is measured in dBc.
6
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