参数资料
型号: TRM-418-LT
厂商: Linx Technologies Inc
文件页数: 30/44页
文件大小: 0K
描述: TRANSCEIVER RF 418MHZ LT SERIES
特色产品: LT Series Long-Range RF Transceiver Modules
标准包装: 34
系列: LT
频率: 418MHz
数据传输率 - 最大: 10kbps
调制或协议: AM,OOK
应用: 双向传呼,ISM,机器人,遥测
功率 - 输出: 10dBm
灵敏度: -112dBm
电源电压: 2.1 V ~ 3.6 V
电流 - 接收: 6.1mA
电流 - 传输: 12mA
数据接口: PCB,表面贴装
天线连接器: PCB,表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 表面安装
包装: 管件
Automated Assembly
For high-volume assembly, most users will want to auto-place the modules.
The modules have been designed to maintain compatibility with reflow pro-
cessing techniques; however, due to their hybrid nature, certain aspects of
the assembly process are far more critical than for other component types.
Following are brief discussions of the three primary areas where caution
must be observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the
reflow stage. The reflow profile below should not be exceeded, since
excessive temperatures or transport times during reflow will irreparably
damage the modules. Assembly personnel will need to pay careful
attention to the oven’s profile to ensure that it meets the requirements
necessary to successfully reflow all components while still remaining within
the limits mandated by the modules. Figure 31 shows the
recommended reflow oven profile for the modules.
300
250
200
255°C
235°C
217°C
185°C
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
180°C
150
125°C
100
50
0
30
60
90
120
150
180
210
240
270
300
330
360
Time (Seconds)
Figure 31: Maximum Reflow Profile
Shock During Reflow Transport
Since some internal module components may reflow along with the
components placed on the board being assembled, it is imperative that
the modules not be subjected to shock or vibration during the time solder
is liquid. Should a shock be applied, some internal components could be
lifted from their pads, causing the module to not function properly.
– 26 –
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