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| 型号： | TRM-433-LT |
| 厂商： | Linx Technologies Inc |
| 文件页数： | 25/44页 |
| 文件大小： | 0K |
| 描述： | TRANSCEIVER RF 433MHZ LT SERIES |
| 产品目录绘图： | TRM-433-LT Top TRM-433-LT Side |
| 特色产品： | LT Series Long-Range RF Transceiver Modules |
| 标准包装： | 34 |
| 系列： | LT |
| 频率： | 433MHz |
| 数据传输率 - 最大： | 10kbps |
| 调制或协议： | AM，OOK |
| 应用： | 双向传呼，ISM，机器人，遥测 |
| 功率 - 输出： | 10dBm |
| 灵敏度： | -112dBm |
| 电源电压： | 2.1 V ~ 3.6 V |
| 电流 - 接收： | 6.1mA |
| 电流 - 传输： | 12mA |
| 数据接口： | PCB，表面贴装 |
| 天线连接器： | PCB，表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 表面安装 |
| 包装： | 管件 |
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A 750-ohm resistor is used on the LADJ line of the transceiver to reduce
the output power of the transmitter to meet North American certification
requirements. This value may need to be adjusted depending on antenna
efficiency and the power allowed in the country of operation.
Board Layout Guidelines
If you are at all familiar with RF devices, you may be concerned about
specialized board layout requirements. Fortunately, because of the care
taken by Linx in designing the modules, integrating them is straightforward.
Despite this ease of application, it is still necessary to maintain respect for
the RF stage and exercise appropriate care in layout and application in
order to maximize performance and ensure reliable operation. The antenna
can also be influenced by layout choices. Please review this data guide
in its entirety prior to beginning your design. By adhering to good layout
principles and observing some basic design rules, you will be on the path
to RF success.
Figure 25 shows the suggested PCB
footprint for the module. The actual
pad dimensions are shown in the
Pad Layout section of this manual. A
ground plane (as large as possible)
should be placed on a lower layer of
your PC board opposite the module.
This ground plane can also be critical
to the performance of your antenna,
which will be discussed later. There
should not be any ground or traces
GROUND PLANE
ON LOWER LAYER
Figure 25: Suggested PCB Layout
under the module on the same layer
as the module, just bare PCB.
During prototyping, the module should be soldered to a properly laid-out
circuit board. The use of prototyping or “perf” boards will result in horrible
performance and is strongly discouraged.
No conductive items should be placed within 0.15" of the module’s top or
sides.
Do not route PCB traces directly under the module. The underside of the
module has numerous traces and vias that could short or couple to traces
on the product’s circuit board.
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