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参数资料
| 型号： | TS(X)PC603PMA6ME |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, CQFP240 |
| 封装： | CERQUAD-240 |
| 文件页数： | 5/38页 |
| 文件大小： | 704K |
| 代理商： | TS(X)PC603PMA6ME |
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TSPC603p
13/38
3.4.2.CBGA255 package
The data found in this section concerns 603p’s packaged in the 255-lead 21 mm multi-layer ceramic (MLC), ceramic BGA package.
Data is shown for two cases, the expoded-die case (no heat sink) and using the Thermalloy 2338-pin fin heat sink.
3.4.2.1. Thermal characteristics
The internal thermal resistance for this package is negligible due to the exposed die design. A heat sink is attached directly to the
silicon die surface only when external thermal enhancement is necessary.
Additionally, the CBGA package offers an excellent thermal connection to the card and power planes. Heat generated at the chip is
dissipated through the package, the heat sink (when used) and the card. The parallel heat flow paths result in the lowest overall
thermal resistance as well as offer significaltly better power dissipation capability when a heat sink is not used.
The thermal characteristics for the flip–chip CBGA package are as follows :
Thermal resistance (junction-to-case) = Rqjc or qjc = 0.08°C/Watt.
Thermal resistance (junction-to-ball) = Rqjb or qjb = 2.8°C/Watt .
3.4.2.2. Thermal management example
The calculations are performed exactly as shown in theprevious section for CPFP240. Figure 6 shows typical thermal performance
data for the 21 mm CBGA package mounted to a test card.
0
5
10
15
20
012
345
Approach air velocity (m/sec)
CBGA with exposed die
CBGA with thermalloy
2338B-pin fin heat sink
qja (°C/W)
Assumptions :
1. 2P card with 1 OZ Cu planes
2. 63 mm x 76 mm card
3. Air flow on both sides of card
4. Vercical orientation
5. 2-stage epoxy heat sink attach
Figure 6 : CBGA thermal management example
Temperature calculations are also performed identically to those in the previous section. For a power dissipation of 2.5 Watts in an
ambient of 40
°C at 1.0 m/sec, the associated overall thermal resistance and junction temperature, found in Table 6 will result.
Table 6 : Thermal resistance and junction temperature
Configuration
qja (°C/W)
Tj (°C)
Exposed die (no heat sink)
18.4
86
With 2338 heat sink
5.3
53
Vendors such as Aavid Engineering Inc., Thermalloy, and Wakefield Engineering can supply heat sinks with a wide range of thermal
performance.
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