参数资料
型号: TS2007EKIJT
厂商: STMICROELECTRONICS
元件分类: 音频/视频放大
英文描述: 3 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9
封装: ROHS COMPLIANT, BGA-9
文件页数: 19/28页
文件大小: 451K
代理商: TS2007EKIJT
Package information
TS2007FC
26/28
Figure 49.
9-bump flip-chip package mechanical data
Die size: 1.57 mm x 1.57 mm ±30 m
Die height (including bumps): 600 m
Bump diameter: 315 m ±50 m
Bump diameter before reflow: 300 m ±10 m
Bump height: 250 m ±40 m
Die height: 350 m ±20 m
Pitch: 500 m ±50 m
Back coating layer height*: 40 m ±10 m
Coplanarity: 50 m max
* Optional
600m
40m
600m
40m
1.57 mm
0.5mm
0.25mm
1.57 mm
0.5mm
0.25mm
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