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参数资料
| 型号： | TS3A4751RGYR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 多路复用及模拟开关 |
| 英文描述： | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PQCC14 |
| 封装： | GREEN, PLASTIC, QFN-14 |
| 文件页数： | 12/23页 |
| 文件大小： | 796K |
| 代理商： | TS3A4751RGYR |
ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE THERMAL IMPEDANCE
SCDS227D – JULY 2006 – REVISED JULY 2008 .............................................................................................................................................................. www.ti.com
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SON – RGY
Reel of 2000
TS3A4751RGYR
YC751
–40°C to 85°C
micro QFN – RUC
Reel of 2000
TS3A4751RUCR
3M
TSSOP – PW
Reel of 2000
TS3A4751PWR
YC751
(1)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLE
NO TO COM,
IN
COM TO NO
L
OFF
H
ON
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V+
Supply voltage range referenced to GND(2)
–0.3
4
V
VNO
VCOM
Analog and digital voltage range
–0.3
V+ + 0.3
V
VIN
INO
On-state switch current
VNO, VCOM = 0 to V+
–100
100
mA
ICOM
I+
Continuous current through V+ or GND
±100
mA
IGND
Peak current pulsed at 1 ms, 10% duty cycle
COM, VI/O
±200
mA
TA
Operating temperature range
–40
85
°C
TJ
Junction temperature
150
°C
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Signals on COM or NO exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.
UNIT
PW package
88
θ
JA
Package thermal impedance(1)
RGY package
91.6
°C/W
RUC package
216.7
(1)
The package thermal impedance is measured in accordance with JESD 51-7.
2
Copyright 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A4751
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