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参数资料
| 型号： | TS3V912IN |
| 厂商： | 意法半导体 |
| 英文描述： | IC-DUAL RAIL/RAIL AM |
| 中文描述： | 集成电路双轨/铁路上午 |
| 文件页数： | 11/11页 |
| 文件大小： | 117K |
| 代理商： | TS3V912IN |
Information furnishedis believed tobe accurate and reliable. However,SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of suchinformation nor forany infringement of patentsor other rights of third parties which may result
from itsuse. No license is granted byimplication or otherwiseunder anypatent or patent rights ofSGS-THOMSON Microelectronics.
Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.SGS-THOMSON Microelectronics products are not authorized for useas critical componentsin life
support devices or systems withoutexpress written approval of SGS-THOMSON Microelectronics.
1997 SGS-THOMSON Microelectronics – Printed in Italy – AllRights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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O
P
PACKAGE MECHANICAL DATA
8 PINS- PLASTICMICROPACKAGE (SO)
Dimensions
Millimeters
Typ.
Inches
Typ.
Min.
Max.
1.75
0.25
1.65
0.85
0.48
0.25
0.5
Min.
Max.
0.069
0.010
0.065
0.033
0.019
0.010
0.020
A
a1
a2
a3
b
b1
C
c1
D
E
e
e3
F
L
M
S
0.1
0.004
0.65
0.35
0.19
0.25
0.026
0.014
0.007
0.010
45
o
(typ.)
4.8
5.8
5.0
6.2
0.189
0.228
0.197
0.244
1.27
3.81
0.050
0.150
3.8
0.4
4.0
1.27
0.6
0.150
0.016
0.157
0.050
0.024
8
o
(max.)
S
TS3V912
11/11
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