参数资料
| 型号： | TSL250-080F-2 |
| 厂商： | TE Connectivity |
| 文件页数： | 16/22页 |
| 文件大小： | 0K |
| 描述： | POLYSWITCH PTC RESET 0.08A SMD |
| 产品培训模块： | Circuit Protection Products |
| 标准包装： | 7,500 |
| 系列： | PolySwitch® |
| 电流 - 维持(Ih)： | 80mA |
| 电流 - 跳闸(It)： | 160mA |
| 电流 - 最大： | 3A |
| 电压 - 最大： | 80V |
| R最小/最大： | 5.000 ~ 11.00 欧姆 |
| 跳闸时间： | 0.8s |
| 封装/外壳： | 2-SMD |
| 包装： | 带卷 (TR) |
| 其它名称： | E72246-000 |
Agency Recognition for Telecommunications and Networking Devices
UL
CSA
File # E74889
File #78165C
TüV
Per IEC60730-1
Certificate # for individual products available upon request.
Table T7
Recommended Pad Layouts for Surface-mount Telecommunications and Networking
Devices in millimeters (inches) Nominal
Device
TS250 (All)
TSV250 (All)
TSL250 (All)
TS600 (All)
TSM600 (All)
A
4.60
(0.180)
2.29
(0.090)
3.60
(0.140)
10.42
(0.410)
5.20
(0.205)
B
1.80
(0.070)
2.41
(0.095)
1.80
(0.070)
3.30
(0.130)
17.80
(0.701)
C
6.10
(0.240)
6.35
(0.250)
5.50
(0.220)
3.35
(0.132)
5.54
(0.218)
D
—
—
3.43
(0.135)
—
—
—
—
6.75
(0.266)
E
—
—
—
—
—
—
—
—
2.08
(0.082)
F
—
—
—
—
—
—
—
—
3.12
(0.123)
G
—
—
—
—
—
—
—
—
8.39
(0.331)
Figure
T18
T19
T18
T18
T20
Figure T18
Figure T19
Figure T20
B
A
A
B
B
A
D
A
E G
F
B
C
B
C
C
D
Solder Reflow and Rework Recommendations for Telecommunications Surface-mount Devices
Profile Feature
Pb-Free Assembly
Figure T21
Average ramp up rate (Ts MAX to Tp)
Preheat
? Temperature min. (Ts MIN )
? Temperature max. (Ts MAX )
? Time (ts MIN to ts MAX )
3°C/second max.
150°C
200°C
60-180 seconds
Tp
T L
Ts MAX
Ramp up
tp
t L
Critical Zone
T L to Tp
Time maintained above:
? Temperature (T L )
217°C
Ts MIN
? Time (t L )
Peak/Classification temperature (Tp)
60-150 seconds
260°C
ts
Preheat
Ramp down
12
Time within 5°C of actual peak temperature
Time (tp)
Ramp down rate
20-40 seconds
6°C/second max.
25
Reflow Profile
t 25?C to Peak
Time
Time 25°C to peak temperature
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package
body surface.
Solder Reflow
? Recommended reflow method: IR, vapor phase oven, hot air oven.
? Surface-mount devices are not designed to be wave soldered to the bottom side of the board.
? Recommended maximum paste thickness of 0.25mm (0.010 in).
? Devices can be cleaned using standard industry methods and solvents.
Rework
? If a device is removed from the board, it should be discarded and replaced with a new device.
228
RoHS compliant, ELV compliant
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TSL250-080F-B-0.5-2 | 功能描述:可复位保险丝 Polyswitch 0.08A RoHS:否 制造商:Bourns 电流额定值: 电阻:7.5 Ohms 最大直流电压: 保持电流:0.1 A 安装风格:SMD/SMT 端接类型:SMD/SMT 跳闸电流:0.6 A 引线间隔: 系列:MF-PSHT 工作温度范围:- 40 C to + 125 C |
| TSL2502YS WAF | 制造商:Texas Instruments 功能描述: |
| TSL250R | 制造商:TAOS Inc 功能描述:SENSOR L/VOLTS |
| TSL250RD | 功能描述:光频率和光电压 Light to Voltage Converter RoHS:否 制造商:ams 峰值波长:1000 nm 工作电源电压:5 V 最大工作温度:+ 85 C 最小工作温度:- 25 C 安装风格: 封装 / 箱体: |
| TSL250RD-TR | 功能描述:光频率和光电压 Light to Voltage Converter RoHS:否 制造商:ams 峰值波长:1000 nm 工作电源电压:5 V 最大工作温度:+ 85 C 最小工作温度:- 25 C 安装风格: 封装 / 箱体: |
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