参数资料
| 型号： | TSL250-080F-2 |
| 厂商： | TE Connectivity |
| 文件页数： | 17/22页 |
| 文件大小： | 0K |
| 描述： | POLYSWITCH PTC RESET 0.08A SMD |
| 产品培训模块： | Circuit Protection Products |
| 标准包装： | 7,500 |
| 系列： | PolySwitch® |
| 电流 - 维持(Ih)： | 80mA |
| 电流 - 跳闸(It)： | 160mA |
| 电流 - 最大： | 3A |
| 电压 - 最大： | 80V |
| R最小/最大： | 5.000 ~ 11.00 欧姆 |
| 跳闸时间： | 0.8s |
| 封装/外壳： | 2-SMD |
| 包装： | 带卷 (TR) |
| 其它名称： | E72246-000 |
Wave Soldering and Rework Recommendations for Telecommunications Radial-leaded Devices
Recommended Wave Soldering
Figure T22
? Soldering temperature profile
Temperature characteristic at component terminal with dual
300
250 245?C ... 260?C
10s
wave soldering
200
Rework
150
? If a device is removed from the board, it should be discarded
and replaced with a new device.
100
50
100?C ... 130?C
Forced cooling
0
0
50
100
150
200
250
Time (s)
Table T8
TRF250/TRF600 Tape and Reel Specifications for
Telecommunications and Networking Device
TRF250/TRF600 devices are available in tape and reel packaging per EIA 468-B standard. See Figures T23 and T24 for details.
Dimension
Description
Carrier tape width
Hold down tape width
Top distance between tape edges
Sprocket hole position
Sprocket hole diameter
Abcissa to plane (straight lead)
Abcissa to plane (kinked lead)*
Abcissa to top
Overall width with lead protrusion
Overall width without lead protrusion
Lead protrusion
Protrusion of cut-out
Protrusion beyond hold down tape
Sprocket hole pitch
Device pitch (TRF250 & TRF600-150)
Device pitch (TRF600-160/400)
Pitch tolerance
Tape thickness
Tape thickness with splice*
Splice sprocket hole alignment
Body lateral deviation
Body tape plane deviation
EIA Mark
W
W 4
W 6
W 5
D 0
H
H 0
H 1
—
—
L 1
L
I 2
P 0
—
—
—
t
t 1
—
h
p
IEC Mark
W
W 0
W 2
W 1
D 0
H
H 0
H 1
C 1
C 2
I 1
L
I 2
P 0
—
—
—
t
—
—
h
p
Dimension (mm)
18
5
3
9
4
18.5
16
32.2
43.2
42.5
1.0
11
Not specified
12.7
12.7
25.4
20 consecutive
0.9
2.0
0
0
0
Tolerance
-0.5/+1.0
Minimum
Maximum
-0.5/+0.75
±0.2
±3.0
-0.5/+0.6
Maximum
Maximum
Maximum
Maximum
Maximum
—
±0.3
—
—
±1
Maximum
Maximum
±0.3
±1.0
±1.3
Lead spacing plane deviation
Lead spacing*
Reel width
Reel diameter
Space between flanges less device
Arbor hole diameter
Core diameter
Box
Consecutive missing pieces*
Empty places per reel*
P 1
F
w 2
a
w 1
c
n
—
—
—
P 1
F
w
d
—
f
h
—
—
—
0
5.08
56
370
4.75
26
80
56/372/372
3 maximum
Not specified
±0.7
±0.6
Maximum
Maximum
±3.25
±12.0
Maximum
Maximum
—
—
12
* Differs from EIA specification.
RoHS Compliant, ELV Compliant
229
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TSL250-080F-B-0.5-2 | 功能描述:可复位保险丝 Polyswitch 0.08A RoHS:否 制造商:Bourns 电流额定值: 电阻:7.5 Ohms 最大直流电压: 保持电流:0.1 A 安装风格:SMD/SMT 端接类型:SMD/SMT 跳闸电流:0.6 A 引线间隔: 系列:MF-PSHT 工作温度范围:- 40 C to + 125 C |
| TSL2502YS WAF | 制造商:Texas Instruments 功能描述: |
| TSL250R | 制造商:TAOS Inc 功能描述:SENSOR L/VOLTS |
| TSL250RD | 功能描述:光频率和光电压 Light to Voltage Converter RoHS:否 制造商:ams 峰值波长:1000 nm 工作电源电压:5 V 最大工作温度:+ 85 C 最小工作温度:- 25 C 安装风格: 封装 / 箱体: |
| TSL250RD-TR | 功能描述:光频率和光电压 Light to Voltage Converter RoHS:否 制造商:ams 峰值波长:1000 nm 工作电源电压:5 V 最大工作温度:+ 85 C 最小工作温度:- 25 C 安装风格: 封装 / 箱体: |
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