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参数资料
| 型号： | TSL2569T |
| 厂商： | AMS-TAOS USA Inc |
| 文件页数： | 34/37页 |
| 文件大小： | 785K |
| 描述： | IC LIGHT TO DGTL CONV 6-TMB |
| 标准包装： | 1 |
| 系列： | * |
| 其它名称： | TSL2569-TDKR |
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TSL2568, TSL2569
LIGHT-TO-DIGITAL CONVERTER
TAOS091D DECEMBER 2008
33
The LUMENOLOGY r Company
r
r
Copyright E 2008, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
Tooling Required
D Chipscale
Solder stencil (square aperture size 0.210 mm, stencil thickness of 152 ?/SPAN>m)
D TMB
Solder stencil (aperture size 0.70 mm x 0.90 mm, stencil thickness of 152 ?/SPAN>m)
Process
1. Apply solder paste using stencil
2. Place component
3. Reflow solder/cure
4. X-Ray verify (recommended for chipscale only)
Additional Notes for Chipscale
Placement of the TSL2568/TSL2569 chipscale device onto the gold immersion substrate is accomplished using
a standard surface mount manufacturing process. Using a 152-糾 stencil with a 0.21 mm square aperture, print
solder paste onto the substrate. Machine-place the TSL2568/TSL2569 from the tape onto the substrate. A
suggest pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has a rubber tip with
a diameter of approximately 0.75 mm. The part is picked up from the center of the body.
It is important to use a substrate that has an immersion plating surface. This may be immersion gold, solder,
or white tin. Hot air solder leveled (HASL) substrates are not coplanar, making them difficult to work with.
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