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参数资料
| 型号： | TSPC860SRMZPU40D4 |
| 厂商： | E2V TECHNOLOGIES PLC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 40 MHz, RISC PROCESSOR, PBGA357 |
| 封装： | PLASTIC, BGA-357 |
| 文件页数： | 24/90页 |
| 文件大小： | 2351K |
| 代理商： | TSPC860SRMZPU40D4 |
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30
TSPC860
2129A–HIREL–08/02
Absolute Maximum
Ratings
Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and affect
reliability.
Notes:
1. Junction temperature is a function on on-chip power dissipation, package thermal resistance, mounting site (board) temper-
ature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages
where the pad would be expected to be soldered, junction to case thermal resistance is a simlated value from the junction to
the exposed pas without contact resistance.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction tempera-
ture per JEDEC JESD51-2.
Table 4. Absolute Maximum Rating for the TSPC860
Parameter
Symbol
Min
Max
Unit
I/O Supply Voltage
V
DDH
-0.3
4.0
V
Internal Supply Voltage
VDDL
-0.3
4.0
V
Backup Supply Voltage
KAPWR
-0.3
4.0
V
PLL Supply Voltage
V
DDSYN
-0.3
4.0
V
Input Voltage
VIN
-0.3
5.8
V
Storage Temperature Range
T
STG
-55
+150
°C
Table 5. Thermal Characteristics
Rating
Environnement
Symbol
Rev A
Rev B, C, D
Unit
Junction to Ambient
Natural Convection
Single layer board (1s)
RθJA
31
40
°C/W
Four layer board (2s2p)
RθJMA
20
25
Air Flow (200 ft/min)
Single layer board (1s)
RθJMA
26
32
Four layer board (2s2p)
RθJMA
16
21
Junction to Board
RθJB
815
Junction to Case
RθJC
57
Junction to Package Top
Natural Convection
ψ
JT
12
Air Flow (20 ft/min)
2
3
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