参数资料
型号: TSSEVB
厂商: Freescale Semiconductor
文件页数: 27/31页
文件大小: 0K
描述: BOARD EVALUATION TOUCH SENSING
标准包装: 1
传感器类型: 触摸,电容式
接口: USB
嵌入式: 是,MCU,8 位
已供物品: 板,线缆,文档,2 个覆盖层
System Overview
2.3.6
BDM Header
BDM has the ability to program either the MC9S08LG32 MCU or the MC9S08JM60 Comm MCU.
1. To choose the MC9S08LG32 MCU as a programming target, place jumpers on position 5–3 and
6–4 on J6.
J6
BDM Header
Figure 2-9. Jumper Placement for the MC9S08LG32 MCU
2. To choose the MC9S08JM60 Comm MCU as a programming target, place jumpers on position 3–1
and 4–2 on J6.
J6
BDM Header
Figure 2-10. Jumper Placement for the MC9S08JM60 Comm MCU
2.3.7
Comm PORT
The communication port provides access to the communication modules of the MC9S08JM60 Comm
MCU. Table 2-4 shows the MC9S08JM60 Comm MCU peripherals.
Table 2-4. MC9S08JM60 Comm MCU Peripherals
2.3.8
MISO1
MOSI1
SPSCK1
SS1
VIN
IIC Communication
1
3
5
7
9
2
4
6
8
10
RX1
TX1
SCL
SDA
GND
When using the Electrode Graphing Tool, the communication between the MC9S08LG32 MCU and the
MC9S08JM60 Comm MCU is required. The communication is achieved through the IIC module from
each MCUs. J10 and J11 connect the IIC modules from both MCUs.
1. To connect the SCL signals of the MC9S08LG32 MCU and the MC9S08JM60 Comm MCU, place
the jumper on J10.
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
2-20
Freescale Semiconductor
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