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参数资料
| 型号： | TSSEVB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 28/31页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION TOUCH SENSING |
| 标准包装： | 1 |
| 传感器类型： | 触摸，电容式 |
| 接口： | USB |
| 嵌入式： | 是，MCU，8 位 |
| 已供物品： | 板，线缆，文档，2 个覆盖层 |
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System Overview
J10
SCL
Figure 2-11. Jumper Placement for SCL Signals
2. To connect the SDA signals of the MC9S08LG32 MCU and the MC9S08JM60 Comm MCU, place
the jumper on J11.
J11
SDA
Figure 2-12. Jumper Placement for SDA Signals
2.3.8.1
Using the TSSEVB IIC Communication Module
You can use the TSSEVB board to monitor the capacitance variations on the electrodes form your
application. The TSSEVB features a Communication MCU that communicates every TSS application with
the Electrode Graphing Tool Software. This section discusses the steps required to use the TSSEVB
communication module as a bridge between your application and the Electrode Graphing Tool (EGT)
software.
2.3.8.1.1
Setting Up the Software
1. Add the EGT communication files to your application. To do so, you must follow the steps
described in "Application Setup" section of the Touch Sensing Software Electrode Graphing Tool
Users Guide (document TSSEGTUG).
2. To access the EGT communication files, first install the EGT software. After the software is
installed, the EGT communication files can be found at the following path:
C:\Program Files\Freescale\Electrode Graphing Tool x.x\Example
TSSEVB_EGT_Example\Sources\EGT
2.3.8.1.2
Setting Up the Hardware
This section describes the steps required to connect the TSS application to the TSSEVB Communication
module.
1. Remove the jumpers located in connectors J10 (SCL) and J11 (SDA) from TSSEVB.
2. Select the appropriated voltage on connector J5 depending on the voltage supplied to your
application.
3. Set the connector J4 jumper to position 2-3 (USB2).
4. Connect the I2C lines from your application to connector J10 and J11 as shown in Figure 2-13 . You
must also have a ground (GND) connection between the TSS application hardware and the
TSSEVB. The TSSEVB Communication module provides the pull-up resistors for the I2C
communication.
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
Freescale Semiconductor
2-21
相关PDF资料 |
PDF描述 |
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| TSW169N202/90 | T-STRUT 16.85"X1" FOR CARD RACK |
| TT129X | PATCHCORD 3-COND 6.0FT |
| TTL-232RG-VREG3V3-WE | CABLE USB SERIAL 3.3V WIRE 250MA |
| TUNAG001 | MODULE MEMS COMPASS SPI CM1015 |
| TUNAG002 | BOARD EVAL MEMS COMPASS CM1015 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TSSF 61 S-J | 制造商:knitter-switch 功能描述: |
| TSSF212H100 | 功能描述:THERMISTOR FLOAT SWTCH 制造商:cynergy 3 系列:* 零件状态:有效 标准包装:1 |
| TSSF212Y100 | 功能描述:THERMISTOR FLOAT SWTCH 制造商:cynergy 3 系列:* 零件状态:有效 标准包装:1 |
| TSSF4500 | 功能描述:红外发射源 22 Degree 35mW 870nm Side View RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
| TSSF4500 | 制造商:Vishay Semiconductors 功能描述:IR Emitting Diode |
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