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参数资料
| 型号： | TVP5147M1IPFPQ1 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 颜色信号转换 |
| 英文描述： | COLOR SIGNAL DECODER, PQFP80 |
| 封装： | PLASTIC, HTQFP-80 |
| 文件页数： | 5/108页 |
| 文件大小： | 937K |
| 代理商： | TVP5147M1IPFPQ1 |
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SLES140F – JULY 2005 – REVISED DECEMBER 2010
www.ti.com
5.2
Designing With PowerPAD Devices
The TVP5147 device is housed in a high-performance, thermally enhanced, 80-terminal PowerPAD
package (TI package designator: 80PFP). Use of the PowerPAD package does not require special
considerations except to note that the thermal pad, which is an exposed die pad on the bottom of the
device, is a metallic thermal and electrical conductor. Therefore, if not implementing the PowerPAD PCB
features, the use of solder masks (or other assembly techniques) can be required to prevent any
inadvertent shorting by the exposed thermal pad of connection etches or vias under the package. The
recommended option, however, is not to run any etches or signal vias under the device, but to have only a
grounded thermal land as in the following explanation. Although the actual size of the exposed die pad
may vary, the minimum size required for the keep-out area for the 80-terminal PFP PowerPAD package is
8 mm × 8 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, under the
PowerPAD package. The thermal land varies in size, depending on the PowerPAD package being used,
the PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may
or may not contain numerous thermal vias, depending on PCB construction.
Other requirements for using thermal lands and thermal vias are detailed in the TI application report
PowerPAD Thermally Enhanced Package (SLMA002), available via the TI web site at http://www.ti.com.
For the TVP5147 device, this thermal land must be grounded to the low-impedance ground plane of the
device. This improves not only thermal performance but also the electrical grounding of the device. It is
also recommended that the device ground terminal landing pads be connected directly to the grounded
thermal land. The land size must be as large as possible without shorting device signal terminals. The
thermal land can be soldered to the exposed thermal pad using standard reflow soldering techniques.
While the thermal land can be electrically floated and configured to remove heat to an external heat sink, it
is recommended that the thermal land be connected to the low-impedance ground plane for the device.
More information can be obtained from the TI application report PHY Layout (SLLA020).
102
Application Information
Copyright 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TVP5147M1
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相关代理商/技术参数 |
参数描述 |
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| TVP5147M1IPFPR | 功能描述:视频 IC 10B Hi Qual Sgl-Chip Dig Video Decoder RoHS:否 制造商:Fairchild Semiconductor 工作电源电压:5 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-28 封装:Reel |
| TVP5147M1PFP | 功能描述:视频 IC 10B High Qual S-Chip Dig Vid Decoder RoHS:否 制造商:Fairchild Semiconductor 工作电源电压:5 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-28 封装:Reel |
| TVP5147M1PFP | 制造商:Texas Instruments 功能描述:; Resolution (Bits):10; Supply Current:5 |
| TVP5147M1PFP_07 | 制造商:TI 制造商全称:Texas Instruments 功能描述:NTSC/PAL/SECAM 2 X 10-Bit Digital Video Decoder With Macrovision Detection, YPbPr Inputs, and 5-Line Comb Filter |
| TVP5147M1PFPG4 | 制造商:TI 制造商全称:Texas Instruments 功能描述:NTSC/PAL/SECAM 2 X 10-Bit Digital Video Decoder With Macrovision Detection, YPbPr Inputs, and 5-Line Comb Filter |
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