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参数资料
| 型号： | TXB2P-032-037B |
| 厂商： | CTS Thermal Management Products |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | THERMAL LINK PRESSON BLK TO-5 |
| 产品目录绘图： | TX(B2)P Series |
| 标准包装： | 100 |
| 类型： | 顶部安装 |
| 冷却式包装： | TO-5 |
| 固定方法： | 压配合，螺栓紧固 |
| 形状： | 圆柱 |
| 长度： | 0.370"（9.40mm） |
| 宽： | 0.380"（9.65mm） |
| 直径： | 0.380"（9.65mm）外径 |
| 自然环境下的热电阻： | 82°C/W |
| 材质： | 黄铜 |
| 材料表面处理： | 黑化镉处理 |
| 其它名称： | 294-1120 TXB2P032037B |
18
iZIF HEAT FRAME
GENERAL DESCRIPTION
The iZIF is a custom aluminum heat frame that integrates
the PCB retainer for improved structural integrity and thermal
efficiency (.8°C-in./W). The iZIF is a highly reliable patent-
pending design for rugged military and aerospace circuit card
applications. It features a quarter-turn lock, uniform clamping
pressure, and can be sized to fit small daughter cards up to
9U VME. A bottom plate may also be added for additional
cooling and structural integrity. The iZIF features a 1/8”
stainless steel socket head cap rod with beryllium copper
spring. A variety of finishes are available such as chemical
film, black anodize, and electroless nickel.
THERMAL LINKS
GENERAL DESCRIPTION
CTS’s thermal links provide superior retention because
of the 6 to 8-segment fingers versus the 2 or 3-segment
fingers available from other manufacturers. These thermal
links are offered for TO-5s, TO-8s and TO-18s with or
without BeO washer and other appropriate hardware.
They provide an effective retainer and efficient thermal
path between semiconductor and heat sinks or chassis.
There is excellent transistor retention under high
vibration and shock loads. The thermal links can be
inserted and removed multiple times without loss of
retention or damage to the finish over the entire JEDEC
case diameter range. They can be installed with a rivet or
eyelet, soldered to a PC pad or heat sink, mounted with a
single screw or with a threaded stud and hex nut.
FAN TOP SERIES
A
B
“A”
“B”
Semiconductor
Part Number
Dim.
Case Type
* °C/W
Unplated
Black Cadmium
Black Chem.
Material
.25
.50
TO-18
150.0
TXBF-019-025U
TXBF-019-025B
N.A.
BeCu
.25
.50
TO-18
150.0
TXCF-019-025U
N.A.
TXCF-019-025CB
Brass
.25
.75
TO-5
81.1
TXBF-032-025U
TXBF-032-025B
N.A.
BeCu
.25
.75
TO-5
81.1
TXCF-032-025U
N.A.
TXCF-032-025CB
Brass
.36
1.25
TO-5
57.7
TXBF2-032-036U
TXBF2-032-036B
N.A.
Brass Fan
BeCu Retainer
.33
1.25
TO-8
41.0
TXBF2-050-033U
TXBF2-050-033B
N.A.
Brass Fan
BeCu Retainer
.12
1.25
TO-5
56.6
TXCF-125-1U
TXCF-125-1CB
N.A.
Brass
.12
1.25
TO-8
56.6
TXCF-125-2U
TXCF-125-2B
N.A.
Brass
Fan Tops
*Natural convection, case-ambient mounted on G10 board
CTS
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| 2-5179030-0 | CONN PLUG 200POS FH .8MM BRD-BRD |
| TXB2-032-037B | THERMAL LINKPRESSON WO/HRDWR TO8 |
| SMAJ13A-E3/61 | TVS UNIDIR 400W 13V 5% SMA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TXB2P-032-037ND | 功能描述:散热片 RoHS:否 制造商:Ampro By ADLINK 产品:Heat Sink Accessories 安装风格:Through Hole 散热片材料: 散热片样式: 热阻: 长度: 宽度: 高度: 设计目的:Express-HRR |
| TXB2P-045-037B | 制造商:CTS Corporation 功能描述:TXB2P Series TO-5 Case Type Black Cad. Finish Heat Sink Elect. Component |
| TXB2P-050-037LI | 制造商:CTS Corporation 功能描述:TX Series Thermal Link Retainers Without BeO Insulator |
| TXB2SIDH | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:Stand-Alone CAN Controller with SPI Interface |
| TXB2SIDL | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:Stand-Alone CAN Controller with SPI Interface |
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